A 10Gb/s compact low-power serial I/O with DFE-IIR equalization in 65nm CMOS
The design of compact low-power I/O transceivers continues to be a challenge for both chip-to-chip and backplane applications. The introduction of dense fine-pitch silicon packaging technologies, that in principle are capable of supporting tens of thousands of high-data-rate I/O for local chip-to-ch...
Main Authors: | Kim, Byungsub, Dickson, Timothy O., Liu, Yong, Bulzacchelli, John F., Friedman, Daniel J. |
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Other Authors: | Massachusetts Institute of Technology. Research Laboratory of Electronics |
Format: | Article |
Language: | en_US |
Published: |
Institute of Electrical and Electronics Engineers
2010
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Online Access: | http://hdl.handle.net/1721.1/59837 |
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