Cooling of high-power-density computer components
This report summarizes work carried out during the first two years of a research program sponsored by IBM Corporation. This study has elucidated a number of the heat-transfer characteristics of several fluorochemicals which have potential application as coolants for high power density computer compo...
| Main Authors: | , , |
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| Format: | Technical Report |
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Cambridge, Mass. : M.I.T. Heat Transfer Laboratory, [1968]
2011
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| Online Access: | http://hdl.handle.net/1721.1/61462 |