A 4-side tileable back illuminated 3D-integrated Mpixel CMOS image sensor

A 4-side tileable back illuminated 3D-integrated Mpixel CMOS image sensor

The dominant trend with conventional image sensors is toward scaled-down pixel sizes to increase spatial resolution and decrease chip size and cost. While highly capable chips, these monolithic image sensors devote substantial perimeter area to signal acquisition and control circuitry and trade off...

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Bibliographic Details
Main Authors: Suntharalingam, Vyshnavi, Berger, Robert, Clark, Stewart, Knecht, Jeffrey M., Messier, Andrew V., Newcomb, Kevin L., Rathman, Dennis D., Slattery, Richard L., Soares, Antonio M., Stevenson, Charles, Warner, Keith, Young, Douglas J., Ang, Lin Ping, Mansoorian, Barmak, Shaver, David C.
Other Authors: Lincoln Laboratory
Format: Article
Language:en_US
Published: Institute of Electrical and Electronics Engineers 2011
Online Access:http://hdl.handle.net/1721.1/62153

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