Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices
We present an approach, which is compatible with both glass and polymer substrates, to in-laboratory handling and intra-laboratory shipping of air-sensitive organic semiconductors. Encapsulation approaches are presented using polymer/ceramic and polymer/metal thin-film barriers using commercially av...
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| Format: | Article |
| Language: | en_US |
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Institute of Electrical and Electronics Engineers
2011
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| Online Access: | http://hdl.handle.net/1721.1/62227 |
| _version_ | 1811080749931036672 |
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| author | Subbarao, Samuel P. Bahlke, Matthias Erhard Kymissis, Ioannis |
| author2 | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science |
| author_facet | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science Subbarao, Samuel P. Bahlke, Matthias Erhard Kymissis, Ioannis |
| author_sort | Subbarao, Samuel P. |
| collection | MIT |
| description | We present an approach, which is compatible with both glass and polymer substrates, to in-laboratory handling and intra-laboratory shipping of air-sensitive organic semiconductors. Encapsulation approaches are presented using polymer/ceramic and polymer/metal thin-film barriers using commercially available materials and generally available laboratory equipment. A technique for depositing an opaque vapor barrier, a transparent vapor barrier, and an approach to storing and shipping air-sensitive thin-film organic semiconductor devices on both polymer and glass substrates are presented. Barrier performance in air was tested using organic light-emitting diodes (OLEDs) as test devices. The half-life performance of OLEDs on plastic substrates in air exceeded 700 h, and that on glass exceeded 500 h. Commercially available heat-seal barrier bag systems for device shipping and storage in air were tested using a thin film of metallic calcium to test water permeation. More than four months of storage of a metallic calcium film in a heat-sealed foil bag was demonstrated in the best storage system. These approaches allow for the encapsulation of samples for longer duration testing and transportation than otherwise possible. |
| first_indexed | 2024-09-23T11:36:10Z |
| format | Article |
| id | mit-1721.1/62227 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T11:36:10Z |
| publishDate | 2011 |
| publisher | Institute of Electrical and Electronics Engineers |
| record_format | dspace |
| spelling | mit-1721.1/622272022-10-01T04:43:12Z Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices Subbarao, Samuel P. Bahlke, Matthias Erhard Kymissis, Ioannis Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science Bahlke, Matthias Erhard Bahlke, Matthias Erhard Kymissis, Ioannis We present an approach, which is compatible with both glass and polymer substrates, to in-laboratory handling and intra-laboratory shipping of air-sensitive organic semiconductors. Encapsulation approaches are presented using polymer/ceramic and polymer/metal thin-film barriers using commercially available materials and generally available laboratory equipment. A technique for depositing an opaque vapor barrier, a transparent vapor barrier, and an approach to storing and shipping air-sensitive thin-film organic semiconductor devices on both polymer and glass substrates are presented. Barrier performance in air was tested using organic light-emitting diodes (OLEDs) as test devices. The half-life performance of OLEDs on plastic substrates in air exceeded 700 h, and that on glass exceeded 500 h. Commercially available heat-seal barrier bag systems for device shipping and storage in air were tested using a thin film of metallic calcium to test water permeation. More than four months of storage of a metallic calcium film in a heat-sealed foil bag was demonstrated in the best storage system. These approaches allow for the encapsulation of samples for longer duration testing and transportation than otherwise possible. United States. Air Force Office of Scientific Research (STTR FA9550-07-C-0056 under a subcontract with QD Vision, Inc.) 2011-04-19T15:34:46Z 2011-04-19T15:34:46Z 2010-01 2009-12 Article http://purl.org/eprint/type/JournalArticle 0018-9383 INSPEC Accession Number: 11024604 http://hdl.handle.net/1721.1/62227 Subbarao, S.P., M.E. Bahlke, and I. Kymissis. “Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices.” Electron Devices, IEEE Transactions On 57.1 (2010) : 153-156. © 2010 IEEE. en_US http://dx.doi.org/10.1109/ted.2009.2034804 IEEE Transactions on Electron Devices Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. application/pdf Institute of Electrical and Electronics Engineers IEEE |
| spellingShingle | Subbarao, Samuel P. Bahlke, Matthias Erhard Kymissis, Ioannis Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices |
| title | Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices |
| title_full | Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices |
| title_fullStr | Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices |
| title_full_unstemmed | Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices |
| title_short | Laboratory Thin-Film Encapsulation of Air-Sensitive Organic Semiconductor Devices |
| title_sort | laboratory thin film encapsulation of air sensitive organic semiconductor devices |
| url | http://hdl.handle.net/1721.1/62227 |
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