Evaluation of phase change materials for reconfigurable interconnects
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2010.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2011
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| Online Access: | http://hdl.handle.net/1721.1/62678 |
| _version_ | 1826210628157571072 |
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| author | Khoo, Chee Ying |
| author2 | Carl V. Thompson and Chee Lip Gan. |
| author_facet | Carl V. Thompson and Chee Lip Gan. Khoo, Chee Ying |
| author_sort | Khoo, Chee Ying |
| collection | MIT |
| description | Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2010. |
| first_indexed | 2024-09-23T14:52:38Z |
| format | Thesis |
| id | mit-1721.1/62678 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T14:52:38Z |
| publishDate | 2011 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/626782019-04-12T12:55:41Z Evaluation of phase change materials for reconfigurable interconnects Khoo, Chee Ying Carl V. Thompson and Chee Lip Gan. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. Materials Science and Engineering. Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2010. Cataloged from PDF version of thesis. Includes bibliographical references (p. 76-80). The possible use of programmable integrated circuit interconnect vias using an indirectly heated phase change material is evaluated. Process development and materials investigations are examined. Devices capable of multiple cycles between on/off states for reconfigurable applications have been successfully demonstrated in a standard CMOS-compatible technology. Building computer chips with these vias would create a new kind of field programmable gate array (FPGA), whereby the design can be reconfigured depending on its application. The phase change reprogrammable-via is nonvolatile, unlike SRAM-based technology. It also has a relatively low on-state resistance and occupies less real estate on the chip. As the "switches" are placed at the metallization level, it provides flexibility for the designer to place them. Programmable-via can operate at a relatively low voltage compared to FLASH-based technology. Similar to the case of antifuses, programmable-via interconnect structures are projected to be radiation hard. However, the most challenging part of implementation is the circuit design. Issues such as integration of materials and design with current tools need to be overcome. A lack of expert personnel in this area also makes the implementation of programmable-via FPGAs complicated. The market for FPGA is promising due to the attraction of the programmable logic market. An intellectual Property (IP) analysis indicates there exist a significant new space for exploration in this area. The best-suited business model is as a new start-up that demonstrates feasibility and develops intellectual property. The potential commercialization of such technology is also discussed. Although this concept is promising result, more research is needed to show the reliability and feasibility of such a technology in complex circuits. It will take some time before this approach can be considered for production. by Chee Ying Khoo. M.Eng. 2011-05-09T15:18:32Z 2011-05-09T15:18:32Z 2010 2010 Thesis http://hdl.handle.net/1721.1/62678 714358160 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 80 p. application/pdf Massachusetts Institute of Technology |
| spellingShingle | Materials Science and Engineering. Khoo, Chee Ying Evaluation of phase change materials for reconfigurable interconnects |
| title | Evaluation of phase change materials for reconfigurable interconnects |
| title_full | Evaluation of phase change materials for reconfigurable interconnects |
| title_fullStr | Evaluation of phase change materials for reconfigurable interconnects |
| title_full_unstemmed | Evaluation of phase change materials for reconfigurable interconnects |
| title_short | Evaluation of phase change materials for reconfigurable interconnects |
| title_sort | evaluation of phase change materials for reconfigurable interconnects |
| topic | Materials Science and Engineering. |
| url | http://hdl.handle.net/1721.1/62678 |
| work_keys_str_mv | AT khoocheeying evaluationofphasechangematerialsforreconfigurableinterconnects |