Layer bonding of solvent-cast thin films for pharmaceutical solid dosage forms

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2010.

Bibliographic Details
Main Author: Kim, Won, S.M. Massachusetts Institute of Technology
Other Authors: Jung-Hoon Chun.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2011
Subjects:
Online Access:http://hdl.handle.net/1721.1/65307
_version_ 1826207425939636224
author Kim, Won, S.M. Massachusetts Institute of Technology
author2 Jung-Hoon Chun.
author_facet Jung-Hoon Chun.
Kim, Won, S.M. Massachusetts Institute of Technology
author_sort Kim, Won, S.M. Massachusetts Institute of Technology
collection MIT
description Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2010.
first_indexed 2024-09-23T13:49:28Z
format Thesis
id mit-1721.1/65307
institution Massachusetts Institute of Technology
language eng
last_indexed 2024-09-23T13:49:28Z
publishDate 2011
publisher Massachusetts Institute of Technology
record_format dspace
spelling mit-1721.1/653072019-04-12T15:25:39Z Layer bonding of solvent-cast thin films for pharmaceutical solid dosage forms Kim, Won, S.M. Massachusetts Institute of Technology Jung-Hoon Chun. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Mechanical Engineering. Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2010. Cataloged from PDF version of thesis. Includes bibliographical references (p. 81-84). In the pharmaceutical industry, the conventional tablet manufacturing process, a batch-based process based on solid powder handling, presents challenges such as inhomogeneous blending between Active Pharmaceutical Ingredients (APIs) and excipients, low yield, and low production rate. These difficulties can be resolved by the realization of a continuous manufacturing process through co-processing of APIs and excipients in the liquid-phase solution. A solvent-cast thin film, produced from liquid solution, can then be manufactured into tablets by way of a folding process. In order to design detailed compaction processes and machines, required compression pressure for layer bonding and mechanical properties of materials should also be investigated. The bonding strength of solvent-cast thin film layers was quantitatively measured by lap shear test. Based on this measurement, bonding threshold pressure was proposed as an indicator showing degree of bonding. At the same time, the layer bonding mechanism of solvent-cast thin films was interpreted as an interdiffusion of amorphous polymer chain end segments. In this context, relative contact area, polymer mobility, which is measured by glass transition temperature, and dwell time were proposed as critical factors in determining bonding threshold pressure. The relationships between those critical factors and process parameters such as surface roughness, residual water and excipient concentration, and compression rate were investigated. The mechanical and viscoelastic properties of solvent-cast thin films were also characterized. Solvent-cast thin films showed ductile-brittle transition, i.e., change of indentation hardness and strength factors among tensile properties with respect to residual water concentration. Changes of creep modulus and tensile properties at various stress levels and strain rates were also observed. by Won Kim. S.M. 2011-08-18T19:16:26Z 2011-08-18T19:16:26Z 2010 2010 Thesis http://hdl.handle.net/1721.1/65307 745767792 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 84 p. application/pdf Massachusetts Institute of Technology
spellingShingle Mechanical Engineering.
Kim, Won, S.M. Massachusetts Institute of Technology
Layer bonding of solvent-cast thin films for pharmaceutical solid dosage forms
title Layer bonding of solvent-cast thin films for pharmaceutical solid dosage forms
title_full Layer bonding of solvent-cast thin films for pharmaceutical solid dosage forms
title_fullStr Layer bonding of solvent-cast thin films for pharmaceutical solid dosage forms
title_full_unstemmed Layer bonding of solvent-cast thin films for pharmaceutical solid dosage forms
title_short Layer bonding of solvent-cast thin films for pharmaceutical solid dosage forms
title_sort layer bonding of solvent cast thin films for pharmaceutical solid dosage forms
topic Mechanical Engineering.
url http://hdl.handle.net/1721.1/65307
work_keys_str_mv AT kimwonsmmassachusettsinstituteoftechnology layerbondingofsolventcastthinfilmsforpharmaceuticalsoliddosageforms