A study of through-silicon-via (TSV) induced transistor variation

A study of through-silicon-via (TSV) induced transistor variation

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2011.

Bibliographic Details
Main Author:	Yu, Li, S.M. Massachusetts Institute of Technology
Other Authors:	Duane S. Boning.
Format:	Thesis
Language:	eng
Published:	Massachusetts Institute of Technology 2011
Subjects:	Electrical Engineering and Computer Science.
Online Access:	http://hdl.handle.net/1721.1/66483

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