MEMS-based thermal management of high heat flux devices edifice: Embedded droplet impingement for integrated cooling of electronics
Increases in microprocessor power dissipation coupled with reductions in feature sizes due to manufacturing process improvements have resulted in continuously increasing heat fluxes. The ever increasing chip-level heat flux has necessitated the development of thermal management devices based on s...
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| Format: | Article |
| Language: | en_US |
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2004
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| Online Access: | http://hdl.handle.net/1721.1/7300 |