Microscale thermal engineering of electronic systems
The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on mic...
| Main Author: | |
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| Format: | Presentation |
| Language: | en_US |
| Published: |
2004
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| Online Access: | http://hdl.handle.net/1721.1/7305 |
| _version_ | 1811092677462065152 |
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| author | Goodson, K.E. |
| author_facet | Goodson, K.E. |
| author_sort | Goodson, K.E. |
| collection | MIT |
| description | The electronics industry is encountering thermal challenges
and opportunities with lengthscales comparable to or much less
than one micrometer. Examples include nanoscale phonon
hotspots in transistors and the increasing temperature rise in onchip
interconnects. Millimeter-scale hotspots on
microprocessors, resulting from varying rates of power
consumption, are being addressed using two-phase
microchannel heat sinks. Nanoscale thermal data storage
technology has received much attention recently. This paper
provides an overview of these topics with a focus on related
research at Stanford University. |
| first_indexed | 2024-09-23T15:22:25Z |
| format | Presentation |
| id | mit-1721.1/7305 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T15:22:25Z |
| publishDate | 2004 |
| record_format | dspace |
| spelling | mit-1721.1/73052019-09-12T11:06:59Z Microscale thermal engineering of electronic systems Goodson, K.E. The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on microprocessors, resulting from varying rates of power consumption, are being addressed using two-phase microchannel heat sinks. Nanoscale thermal data storage technology has received much attention recently. This paper provides an overview of these topics with a focus on related research at Stanford University. 2004-10-28T19:45:39Z 2004-10-28T19:45:39Z 2003-05 Presentation Technical Report http://hdl.handle.net/1721.1/7305 en_US 1587318 bytes 323957 bytes application/pdf application/pdf application/pdf |
| spellingShingle | Goodson, K.E. Microscale thermal engineering of electronic systems |
| title | Microscale thermal engineering of electronic systems |
| title_full | Microscale thermal engineering of electronic systems |
| title_fullStr | Microscale thermal engineering of electronic systems |
| title_full_unstemmed | Microscale thermal engineering of electronic systems |
| title_short | Microscale thermal engineering of electronic systems |
| title_sort | microscale thermal engineering of electronic systems |
| url | http://hdl.handle.net/1721.1/7305 |
| work_keys_str_mv | AT goodsonke microscalethermalengineeringofelectronicsystems |