Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration
Silicon-on-lattice engineered substrates (SOLES) are SOI substrates with embedded Ge layers that facilitate III-V compound integration for advanced integrated circuits. The new materials integration scheme in SOLES requires the analysis of its thermal stability and diffusion barrier properties. In t...
Autori principali: | Bulsara, Mayank, Fitzgerald, Eugene A., Yang, N., Liu, W. K., Lubyshev, D., Fastenau, J. M., Wu, Y., Urteaga, M., Ha, W., Bergman, J., Brar, B., Drazek, C., Daval, N., Benaissa, L., Augendre, E., Hoke, William E., LaRoche, J. R., Herrick, K. J., Kazior, T. E. |
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Altri autori: | Massachusetts Institute of Technology. Department of Materials Science and Engineering |
Natura: | Articolo |
Lingua: | en_US |
Pubblicazione: |
Institute of Electrical and Electronics Engineers (IEEE)
2012
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Accesso online: | http://hdl.handle.net/1721.1/73512 https://orcid.org/0000-0002-1891-1959 |
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