Low contact resistivity of metals on nitrogen-doped cuprous oxide (Cu 2O) thin-films

Forming low-resistivity contacts on cuprous oxide (Cu[subscript 2]O) is an essential step toward demonstrating its suitability as a candidate solar cell material. We measure the contact resistivity of three noble metals (Au, Ag, and Pd) on sputtered Cu[subscript 2]O thin-films with a range of nitrog...

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Main Authors: Siah, Sin Cheng, Lee, Yun Seog, Segal, Yaron, Buonassisi, Anthony
Other Authors: Massachusetts Institute of Technology. Department of Mechanical Engineering
Format: Article
Language:en_US
Published: American Institute of Physics (AIP) 2013
Online Access:http://hdl.handle.net/1721.1/78017
https://orcid.org/0000-0001-8345-4937
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author Siah, Sin Cheng
Lee, Yun Seog
Segal, Yaron
Buonassisi, Anthony
author2 Massachusetts Institute of Technology. Department of Mechanical Engineering
author_facet Massachusetts Institute of Technology. Department of Mechanical Engineering
Siah, Sin Cheng
Lee, Yun Seog
Segal, Yaron
Buonassisi, Anthony
author_sort Siah, Sin Cheng
collection MIT
description Forming low-resistivity contacts on cuprous oxide (Cu[subscript 2]O) is an essential step toward demonstrating its suitability as a candidate solar cell material. We measure the contact resistivity of three noble metals (Au, Ag, and Pd) on sputtered Cu[subscript 2]O thin-films with a range of nitrogen doping levels. Using the circular transmission line model, specific contact resistivity as low as 1.1 × 10[superscript −4] Ω · cm[superscript 2] is measured for Pd contacts on heavily doped Cu[subscript 2]O films. Temperature-dependent current-voltage measurements and X-ray photoemission spectroscopy are used to determine the barrier heights formed at metal/Cu[subscript 2] Ointerfaces. Thermionic emission is observed to dominate for undoped films, whilst field emission dominates for heavily doped films, highlighting the importance of carrier concentration on contact resistivity. Finally, we demonstrate that low contact resistivity can be achieved on heavily doped Cu[subscript 2] films using Earth-abundant metals, such as Cu and Ni.
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spelling mit-1721.1/780172022-09-30T21:51:54Z Low contact resistivity of metals on nitrogen-doped cuprous oxide (Cu 2O) thin-films Siah, Sin Cheng Lee, Yun Seog Segal, Yaron Buonassisi, Anthony Massachusetts Institute of Technology. Department of Mechanical Engineering Massachusetts Institute of Technology. Laboratory for Manufacturing and Productivity Siah, Sin Cheng Lee, Yun Seog Segal, Yaron Buonassisi, Tonio Forming low-resistivity contacts on cuprous oxide (Cu[subscript 2]O) is an essential step toward demonstrating its suitability as a candidate solar cell material. We measure the contact resistivity of three noble metals (Au, Ag, and Pd) on sputtered Cu[subscript 2]O thin-films with a range of nitrogen doping levels. Using the circular transmission line model, specific contact resistivity as low as 1.1 × 10[superscript −4] Ω · cm[superscript 2] is measured for Pd contacts on heavily doped Cu[subscript 2]O films. Temperature-dependent current-voltage measurements and X-ray photoemission spectroscopy are used to determine the barrier heights formed at metal/Cu[subscript 2] Ointerfaces. Thermionic emission is observed to dominate for undoped films, whilst field emission dominates for heavily doped films, highlighting the importance of carrier concentration on contact resistivity. Finally, we demonstrate that low contact resistivity can be achieved on heavily doped Cu[subscript 2] films using Earth-abundant metals, such as Cu and Ni. National Science Foundation (U.S.) (Award DMR-0819762) National Science Foundation (U.S.) (Award ECS-0335765) National Science Foundation (U.S.). CAREER (Award ECCS-1150878) 2013-03-28T16:31:36Z 2013-03-28T16:31:36Z 2012-10 2012-07 Article http://purl.org/eprint/type/JournalArticle 0021-8979 1089-7550 http://hdl.handle.net/1721.1/78017 Siah, Sin Cheng et al. “Low Contact Resistivity of Metals on Nitrogen-doped Cuprous Oxide (Cu2O) Thin-films.” Journal of Applied Physics 112.8 (2012): 084508. © 2012 American Institute of Physics https://orcid.org/0000-0001-8345-4937 en_US http://dx.doi.org/10.1063/1.4758305 Journal of Applied Physics Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. application/pdf American Institute of Physics (AIP) MIT web domain
spellingShingle Siah, Sin Cheng
Lee, Yun Seog
Segal, Yaron
Buonassisi, Anthony
Low contact resistivity of metals on nitrogen-doped cuprous oxide (Cu 2O) thin-films
title Low contact resistivity of metals on nitrogen-doped cuprous oxide (Cu 2O) thin-films
title_full Low contact resistivity of metals on nitrogen-doped cuprous oxide (Cu 2O) thin-films
title_fullStr Low contact resistivity of metals on nitrogen-doped cuprous oxide (Cu 2O) thin-films
title_full_unstemmed Low contact resistivity of metals on nitrogen-doped cuprous oxide (Cu 2O) thin-films
title_short Low contact resistivity of metals on nitrogen-doped cuprous oxide (Cu 2O) thin-films
title_sort low contact resistivity of metals on nitrogen doped cuprous oxide cu 2o thin films
url http://hdl.handle.net/1721.1/78017
https://orcid.org/0000-0001-8345-4937
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AT segalyaron lowcontactresistivityofmetalsonnitrogendopedcuprousoxidecu2othinfilms
AT buonassisianthony lowcontactresistivityofmetalsonnitrogendopedcuprousoxidecu2othinfilms