Molecular dynamics simulation of thermal energy transport in polydimethylsiloxane (PDMS)
Heat transfer across thermal interface materials is a critical issue for microelectronics thermal management. Polydimethylsiloxane (PDMS), one of the most important components of thermal interface materials presents a large barrier for heat flow due to its low thermal conductivity. In this paper, we...
Main Authors: | Luo, Tengfei, Esfarjani, Keivan, Shiomi, Junichiro, Henry, Asegun, Chen, Gang |
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Other Authors: | Massachusetts Institute of Technology. Department of Mechanical Engineering |
Format: | Article |
Language: | en_US |
Published: |
American Institute of Physics (AIP)
2013
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Online Access: | http://hdl.handle.net/1721.1/78258 https://orcid.org/0000-0002-3968-8530 |
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