Nanoantenna couplers for metal-insulator-metal waveguide interconnects
State-of-the-art copper interconnects suffer from increasing spatial power dissipation due to chip downscaling and RC delays reducing operation bandwidth. Wide bandwidth, minimized Ohmic loss, deep sub-wavelength confinement and high integration density are key features that make metal-insulator-met...
| Main Authors: | , |
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| מחברים אחרים: | |
| פורמט: | Article |
| שפה: | en_US |
| יצא לאור: |
SPIE--the International Society for Optical Engineering
2013
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| גישה מקוונת: | http://hdl.handle.net/1721.1/78297 |