A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2013
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| Online Access: | http://hdl.handle.net/1721.1/80148 |
| _version_ | 1826205048298799104 |
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| author | Yung, Chi-Fan, 1973- |
| author2 | Martin A. Schmidt. |
| author_facet | Martin A. Schmidt. Yung, Chi-Fan, 1973- |
| author_sort | Yung, Chi-Fan, 1973- |
| collection | MIT |
| description | Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999. |
| first_indexed | 2024-09-23T13:06:15Z |
| format | Thesis |
| id | mit-1721.1/80148 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T13:06:15Z |
| publishDate | 2013 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/801482019-04-11T13:44:44Z A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding Yung, Chi-Fan, 1973- Martin A. Schmidt. Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science. Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science. Electrical Engineering and Computer Science. Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999. Includes bibliographical references (p. 89-90). by Chi-Fan Yung. S.M. 2013-08-22T18:54:38Z 2013-08-22T18:54:38Z 1999 1999 Thesis http://hdl.handle.net/1721.1/80148 43626577 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 90 p. application/pdf Massachusetts Institute of Technology |
| spellingShingle | Electrical Engineering and Computer Science. Yung, Chi-Fan, 1973- A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding |
| title | A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding |
| title_full | A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding |
| title_fullStr | A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding |
| title_full_unstemmed | A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding |
| title_short | A process technology for realizing integrated inertial sensors using deep reactive ion etching (DRIE) and aligned wafer bonding |
| title_sort | process technology for realizing integrated inertial sensors using deep reactive ion etching drie and aligned wafer bonding |
| topic | Electrical Engineering and Computer Science. |
| url | http://hdl.handle.net/1721.1/80148 |
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