High Performance Mixed Signal Circuits Enabled by the Direct Monolithic Heterogeneous Integration of InP HBT and Si CMOS on a Silicon Substrate
We present recent results on the direct heterogeneous integration of InP HBTs and Si CMOS on a silicon template wafer or SOLES (Silicon On Lattice Engineered Substrate). InP HBTs whose performance are comparable to HBTs on the native InP substrates have been repeatedly achieved. 100% heterogeneous i...
Main Authors: | Kazior, T. E., LaRoche, J. R., Urteaga, M., Bergman, J., Choe, M. J., Lee, K. J., Seong, T., Seo, M., Yen, A., Lubyshev, D., Fastenau, J. M., Liu, W. K., Smith, D., Clark, D., Thompson, R., Bulsara, Mayank, Fitzgerald, Eugene A., Drazek, C., Guiot, E. |
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Other Authors: | MIT Materials Research Laboratory |
Format: | Article |
Language: | en_US |
Published: |
Institute of Electrical and Electronics Engineers
2013
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Online Access: | http://hdl.handle.net/1721.1/81316 https://orcid.org/0000-0002-1891-1959 |
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