Development of a precision hot embossing machine with in-process sensing

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2013.

Bibliographic Details
Main Author: Bageant, Maia R. (Maia Reynolds)
Other Authors: David Hardt.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2013
Subjects:
Online Access:http://hdl.handle.net/1721.1/81732
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author Bageant, Maia R. (Maia Reynolds)
author2 David Hardt.
author_facet David Hardt.
Bageant, Maia R. (Maia Reynolds)
author_sort Bageant, Maia R. (Maia Reynolds)
collection MIT
description Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2013.
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spelling mit-1721.1/817322019-04-12T20:43:42Z Development of a precision hot embossing machine with in-process sensing Bageant, Maia R. (Maia Reynolds) David Hardt. Massachusetts Institute of Technology. Department of Mechanical Engineering. Massachusetts Institute of Technology. Department of Mechanical Engineering. Mechanical Engineering. Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2013. This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections. Cataloged from student-submitted PDF version of thesis. Includes bibliographical references (p. 121-123). Microuidic technologies show great promise in simplifying and speeding biological, medical, and fluidic tasks, but transitioning these technologies from a laboratory environment to a production environment has proven difficult. This work focuses on hot embossing as a process suitable to produce these devices. In this work, a precision micro-embossing machine capable of maintaining precise setpoints in force and temperature input as well as displaying highly linear, repeatable motion and force application is developed and characterized. Additionally, this equipment is then outfitted with additional sensors that allow for three measurements relevant to process physics and product quality to be captured: initial substrate geometry; substrate bulk deformation; and glass transition temperature of the material. These measurements can be captured in-process without modifying the production cycle. The end goal is to incorporate this precision micro-embossing machine into a micro-factory cell and to implement closed-loop cycle-to-cycle process control. by Maia R. Bageant. S.M. 2013-10-24T18:10:23Z 2013-10-24T18:10:23Z 2013 2013 Thesis http://hdl.handle.net/1721.1/81732 858811074 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 123 p. application/pdf Massachusetts Institute of Technology
spellingShingle Mechanical Engineering.
Bageant, Maia R. (Maia Reynolds)
Development of a precision hot embossing machine with in-process sensing
title Development of a precision hot embossing machine with in-process sensing
title_full Development of a precision hot embossing machine with in-process sensing
title_fullStr Development of a precision hot embossing machine with in-process sensing
title_full_unstemmed Development of a precision hot embossing machine with in-process sensing
title_short Development of a precision hot embossing machine with in-process sensing
title_sort development of a precision hot embossing machine with in process sensing
topic Mechanical Engineering.
url http://hdl.handle.net/1721.1/81732
work_keys_str_mv AT bageantmaiarmaiareynolds developmentofaprecisionhotembossingmachinewithinprocesssensing