The Follow-Up: Added Value from Textron Systems SFW Value Stream Mapping Event
Over a six-day period in the final quarter of 2004, members of the Lean Aerospace Initiative (LAI), Massachusetts Manufacturing Extension Partnership, Rockwell Collins, and Metis Design met with host company Textron Systems in a collaborative effort to map the enterprise value stream of Textron’s...
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| Format: | Article |
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2014
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| Online Access: | http://hdl.handle.net/1721.1/83577 |
| _version_ | 1826212123052605440 |
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| author | Bentley, Geoff Bednar, Tom Groesbeck, Geoff |
| author_facet | Bentley, Geoff Bednar, Tom Groesbeck, Geoff |
| author_sort | Bentley, Geoff |
| collection | MIT |
| description | Over a six-day period in the final quarter of 2004, members of the Lean Aerospace
Initiative (LAI), Massachusetts Manufacturing Extension Partnership, Rockwell Collins,
and Metis Design met with host company Textron Systems in a collaborative effort to
map the enterprise value stream of Textron’s Sensor Fuzed Weapon (SFW) program. The
workshop also included participation from the US Air Force (USAF), Alliant
Techsystems, Cessna Aircraft, Herley Industries, and Pioneer Aerospace.
This commentary describes the results and follow-up in the six months since the
workshop was held. Some of this information is contained also in a presentation of Geoff
Bentley and Hugh McManus, entitled “Textron Systems Sensor Fuzed Weapon VSM
Event: Using LAI Tools to Transform a Program Enterpise”, delivered at the LAI Plenary
Conference on 23 March 2005. |
| first_indexed | 2024-09-23T15:16:25Z |
| format | Article |
| id | mit-1721.1/83577 |
| institution | Massachusetts Institute of Technology |
| last_indexed | 2024-09-23T15:16:25Z |
| publishDate | 2014 |
| record_format | dspace |
| spelling | mit-1721.1/835772019-04-10T13:08:37Z The Follow-Up: Added Value from Textron Systems SFW Value Stream Mapping Event Bentley, Geoff Bednar, Tom Groesbeck, Geoff LAI Textron Systems workshop waste elimination enterprise lean lean enterprise value (LEV) simulation Over a six-day period in the final quarter of 2004, members of the Lean Aerospace Initiative (LAI), Massachusetts Manufacturing Extension Partnership, Rockwell Collins, and Metis Design met with host company Textron Systems in a collaborative effort to map the enterprise value stream of Textron’s Sensor Fuzed Weapon (SFW) program. The workshop also included participation from the US Air Force (USAF), Alliant Techsystems, Cessna Aircraft, Herley Industries, and Pioneer Aerospace. This commentary describes the results and follow-up in the six months since the workshop was held. Some of this information is contained also in a presentation of Geoff Bentley and Hugh McManus, entitled “Textron Systems Sensor Fuzed Weapon VSM Event: Using LAI Tools to Transform a Program Enterpise”, delivered at the LAI Plenary Conference on 23 March 2005. 2014-01-07T21:47:12Z 2014-01-07T21:47:12Z 2005 Article Presentation Other http://hdl.handle.net/1721.1/83577 Attribution-NonCommercial-ShareAlike 3.0 United States http://creativecommons.org/licenses/by-nc-sa/3.0/us/ application/pdf |
| spellingShingle | LAI Textron Systems workshop waste elimination enterprise lean lean enterprise value (LEV) simulation Bentley, Geoff Bednar, Tom Groesbeck, Geoff The Follow-Up: Added Value from Textron Systems SFW Value Stream Mapping Event |
| title | The Follow-Up: Added Value from Textron Systems SFW Value Stream Mapping Event |
| title_full | The Follow-Up: Added Value from Textron Systems SFW Value Stream Mapping Event |
| title_fullStr | The Follow-Up: Added Value from Textron Systems SFW Value Stream Mapping Event |
| title_full_unstemmed | The Follow-Up: Added Value from Textron Systems SFW Value Stream Mapping Event |
| title_short | The Follow-Up: Added Value from Textron Systems SFW Value Stream Mapping Event |
| title_sort | follow up added value from textron systems sfw value stream mapping event |
| topic | LAI Textron Systems workshop waste elimination enterprise lean lean enterprise value (LEV) simulation |
| url | http://hdl.handle.net/1721.1/83577 |
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