Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits

Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits

Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1999.

Bibliographic Details
Main Author: Srikar, V. T. (Vengallatore Thattai), 1972-
Other Authors: Carl V. Thompson.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2014
Subjects:
Materials Science and Engineering
Online Access:http://hdl.handle.net/1721.1/85249

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