DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling

With the rise of many-core chips that require substantial bandwidth from the network on chip (NoC), integrated photonic links have been investigated as a promising alternative to traditional electrical interconnects. While numerous opto-electronic NoCs have been proposed, evaluations of photonic arc...

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Main Authors: Sun, Chen, Kurian, George, Wei, Lan, Agarwal, Anant, Peh, Li-Shiuan, Stojanovic, Vladimir, Chen, Chia-Hsin, Miller, Jason E.
Other Authors: delete
Format: Article
Language:en_US
Published: Institute of Electrical and Electronics Engineers (IEEE) 2014
Online Access:http://hdl.handle.net/1721.1/85863
https://orcid.org/0000-0001-9010-6519
https://orcid.org/0000-0002-7015-4262
https://orcid.org/0000-0003-1284-6620
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author Sun, Chen
Kurian, George
Wei, Lan
Agarwal, Anant
Peh, Li-Shiuan
Stojanovic, Vladimir
Chen, Chia-Hsin
Miller, Jason E.
author2 delete
author_facet delete
Sun, Chen
Kurian, George
Wei, Lan
Agarwal, Anant
Peh, Li-Shiuan
Stojanovic, Vladimir
Chen, Chia-Hsin
Miller, Jason E.
author_sort Sun, Chen
collection MIT
description With the rise of many-core chips that require substantial bandwidth from the network on chip (NoC), integrated photonic links have been investigated as a promising alternative to traditional electrical interconnects. While numerous opto-electronic NoCs have been proposed, evaluations of photonic architectures have thus-far had to use a number of simplifications, reflecting the need for a modeling tool that accurately captures the tradeoffs for the emerging technology and its impacts on the overall network. In this paper, we present DSENT, a NoC modeling tool for rapid design space exploration of electrical and opto-electrical networks. We explain our modeling framework and perform an energy-driven case study, focusing on electrical technology scaling, photonic parameters, and thermal tuning. Our results show the implications of different technology scenarios and, in particular, the need to reduce laser and thermal tuning power in a photonic network due to their non-data-dependent nature.
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spelling mit-1721.1/858632022-10-01T06:22:44Z DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling Sun, Chen Kurian, George Wei, Lan Agarwal, Anant Peh, Li-Shiuan Stojanovic, Vladimir Chen, Chia-Hsin Miller, Jason E. delete Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science Sun, Chen Chen, Chia-Hsin Kurian, George Wei, Lan Miller, Jason E. Agarwal, Anant Peh, Li-Shiuan Stojanovic, Vladimir With the rise of many-core chips that require substantial bandwidth from the network on chip (NoC), integrated photonic links have been investigated as a promising alternative to traditional electrical interconnects. While numerous opto-electronic NoCs have been proposed, evaluations of photonic architectures have thus-far had to use a number of simplifications, reflecting the need for a modeling tool that accurately captures the tradeoffs for the emerging technology and its impacts on the overall network. In this paper, we present DSENT, a NoC modeling tool for rapid design space exploration of electrical and opto-electrical networks. We explain our modeling framework and perform an energy-driven case study, focusing on electrical technology scaling, photonic parameters, and thermal tuning. Our results show the implications of different technology scenarios and, in particular, the need to reduce laser and thermal tuning power in a photonic network due to their non-data-dependent nature. United States. Defense Advanced Research Projects Agency National Science Foundation (U.S.) Focus Center Research Program Microelectronics Advanced Research Corporation (MARCO). Interconnect Focus Center Singapore-MIT Alliance for Research and Technology Center. Low Energy Electronic Systems United States. National Security Agency. Trusted Access Program Office Intel Corporation APIC Corporation MIT Center for Integrated Circuits and Systems 2014-03-21T13:45:01Z 2014-03-21T13:45:01Z 2012-05 Article http://purl.org/eprint/type/ConferencePaper 978-1-4673-0973-8 978-0-7695-4677-3 http://hdl.handle.net/1721.1/85863 Sun, Chen, Chia-Hsin Owen Chen, George Kurian, Lan Wei, Jason Miller, Anant Agarwal, Li-Shiuan Peh, and Vladimir Stojanovic. “DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling.” 2012 IEEE/ACM Sixth International Symposium on Networks-on-Chip (n.d.). https://orcid.org/0000-0001-9010-6519 https://orcid.org/0000-0002-7015-4262 https://orcid.org/0000-0003-1284-6620 en_US http://dx.doi.org/10.1109/NOCS.2012.31 Proceedings of the 2012 IEEE/ACM Sixth International Symposium on Networks-on-Chip Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/ application/pdf Institute of Electrical and Electronics Engineers (IEEE) MIT web domain
spellingShingle Sun, Chen
Kurian, George
Wei, Lan
Agarwal, Anant
Peh, Li-Shiuan
Stojanovic, Vladimir
Chen, Chia-Hsin
Miller, Jason E.
DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling
title DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling
title_full DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling
title_fullStr DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling
title_full_unstemmed DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling
title_short DSENT - A Tool Connecting Emerging Photonics with Electronics for Opto-Electronic Networks-on-Chip Modeling
title_sort dsent a tool connecting emerging photonics with electronics for opto electronic networks on chip modeling
url http://hdl.handle.net/1721.1/85863
https://orcid.org/0000-0001-9010-6519
https://orcid.org/0000-0002-7015-4262
https://orcid.org/0000-0003-1284-6620
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