PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices
Origami is traditionally implemented in paper, which is a passive material. This research explores the use of material with embedded electronics such as printed circuit boards (PCB) as the medium for origami folding to create an interactive folding experience and to generate foldable objects with ad...
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| Other Authors: | |
| Format: | Article |
| Language: | en_US |
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ASME International
2014
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| Online Access: | http://hdl.handle.net/1721.1/86208 https://orcid.org/0000-0001-9222-4447 https://orcid.org/0000-0003-3803-5703 |
| _version_ | 1826215315789316096 |
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| author | Sterman, Yoav Oxman, Neri Demaine, Erik D |
| author2 | Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory |
| author_facet | Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory Sterman, Yoav Oxman, Neri Demaine, Erik D |
| author_sort | Sterman, Yoav |
| collection | MIT |
| description | Origami is traditionally implemented in paper, which is a passive material. This research explores the use of material with embedded electronics such as printed circuit boards (PCB) as the medium for origami folding to create an interactive folding experience and to generate foldable objects with added functionalities. PCBs are produced as 2D shapes. By folding PCB arrays, it is possible to create 3D objects that contain electronic functions. Conductivity, output devices (such as light emitting diodes) and microcontroller computation can create an interactive folding experience, for user guidance and verification of the folding. We call this approach and methodology PCB origami. The work presented in this paper describes two unique interaction and fabrication techniques for creating and folding electronic materials. We demonstrate prototypes and present verification/evaluation strategies for guiding the user through the folding process. |
| first_indexed | 2024-09-23T16:23:26Z |
| format | Article |
| id | mit-1721.1/86208 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T16:23:26Z |
| publishDate | 2014 |
| publisher | ASME International |
| record_format | dspace |
| spelling | mit-1721.1/862082022-09-29T19:42:28Z PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices Sterman, Yoav Oxman, Neri Demaine, Erik D Massachusetts Institute of Technology. Computer Science and Artificial Intelligence Laboratory Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology. Media Laboratory Program in Media Arts and Sciences (Massachusetts Institute of Technology) Sterman, Yoav Demaine, Erik D. Oxman, Neri Origami is traditionally implemented in paper, which is a passive material. This research explores the use of material with embedded electronics such as printed circuit boards (PCB) as the medium for origami folding to create an interactive folding experience and to generate foldable objects with added functionalities. PCBs are produced as 2D shapes. By folding PCB arrays, it is possible to create 3D objects that contain electronic functions. Conductivity, output devices (such as light emitting diodes) and microcontroller computation can create an interactive folding experience, for user guidance and verification of the folding. We call this approach and methodology PCB origami. The work presented in this paper describes two unique interaction and fabrication techniques for creating and folding electronic materials. We demonstrate prototypes and present verification/evaluation strategies for guiding the user through the folding process. 2014-04-17T19:19:13Z 2014-04-17T19:19:13Z 2013-10 2013-06 Article http://purl.org/eprint/type/JournalArticle 1050-0472 http://hdl.handle.net/1721.1/86208 Sterman, Yoav, Erik D. Demaine, and Neri Oxman. “PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices.” Journal of Mechanical Design 135, no. 11 (October 8, 2013): 114502. https://orcid.org/0000-0001-9222-4447 https://orcid.org/0000-0003-3803-5703 en_US http://dx.doi.org/10.1115/1.4025370 Journal of Mechanical Design Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/ application/pdf ASME International MIT web domain |
| spellingShingle | Sterman, Yoav Oxman, Neri Demaine, Erik D PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices |
| title | PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices |
| title_full | PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices |
| title_fullStr | PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices |
| title_full_unstemmed | PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices |
| title_short | PCB Origami: A Material-Based Design Approach to Computer-Aided Foldable Electronic Devices |
| title_sort | pcb origami a material based design approach to computer aided foldable electronic devices |
| url | http://hdl.handle.net/1721.1/86208 https://orcid.org/0000-0001-9222-4447 https://orcid.org/0000-0003-3803-5703 |
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