Bringing cross-layer MIMO to today's wireless LANs
Recent years have seen major innovations in cross-layer wireless designs. Despite demonstrating significant throughput gains, hardly any of these technologies have made it into real networks. Deploying cross-layer innovations requires adoption from Wi-Fi chip manufacturers. Yet, manufacturers hesita...
Main Authors: | Suresh Kumar, Swarun, Cifuentes, Diego Fernando, Gollakota, Shyamnath, Katabi, Dina |
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Other Authors: | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science |
Format: | Article |
Language: | en_US |
Published: |
Association for Computing Machinery
2014
|
Online Access: | http://hdl.handle.net/1721.1/87069 https://orcid.org/0000-0003-4071-4932 https://orcid.org/0000-0003-0222-3761 https://orcid.org/0000-0003-4854-4157 |
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