Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver
This paper demonstrates a four-channel transceiver chip for medical ultrasonic imaging, interfacing to the capacitive micromachined ultrasonic transducers (CMUTs). The high-voltage transmitter (Tx) uses a three-level pulse-shaping technique with charge recycling to improve the power efficiency. The...
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Institute of Electrical and Electronics Engineers (IEEE)
2015
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| Online Access: | http://hdl.handle.net/1721.1/93893 https://orcid.org/0000-0002-7783-0403 https://orcid.org/0000-0002-0413-8774 https://orcid.org/0000-0002-5977-2748 |
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| author | Chen, Kailiang Lee, Hae-Seung Chandrakasan, Anantha P. Sodini, Charles G. |
| author2 | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science |
| author_facet | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science Chen, Kailiang Lee, Hae-Seung Chandrakasan, Anantha P. Sodini, Charles G. |
| author_sort | Chen, Kailiang |
| collection | MIT |
| description | This paper demonstrates a four-channel transceiver chip for medical ultrasonic imaging, interfacing to the capacitive micromachined ultrasonic transducers (CMUTs). The high-voltage transmitter (Tx) uses a three-level pulse-shaping technique with charge recycling to improve the power efficiency. The design requires minimum off-chip components and is scalable for more channels. The receiver is implemented with a transimpedance amplifier (TIA) topology and is optimized for tradeoffs between noise, bandwidth, and power dissipation. The test chip is characterized with both acoustic and electrical measurements. Comparing the three-level pulser against traditional two-level pulsers, the measured Tx efficiency shows 56%, 50%, and 43% more acoustic power delivery with the same total power dissipation at 2.5, 3.3, and 5.0 MHz, respectively. The CMUT receiver achieves the lowest noise efficiency factor compared with that of the literature (2.1 compared to a previously reported lowest of 3.6, in units of mPA ·√(mW/Hz). In addition, the transceiver chip is tested as a complete system for medical ultrasound imaging applications, in experiments including Tx beamformation, pulse-echo channel response characterization, and ultrasonic Doppler flow rate detection. |
| first_indexed | 2024-09-23T17:13:02Z |
| format | Article |
| id | mit-1721.1/93893 |
| institution | Massachusetts Institute of Technology |
| language | en_US |
| last_indexed | 2024-09-23T17:13:02Z |
| publishDate | 2015 |
| publisher | Institute of Electrical and Electronics Engineers (IEEE) |
| record_format | dspace |
| spelling | mit-1721.1/938932022-09-30T00:28:17Z Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver Chen, Kailiang Lee, Hae-Seung Chandrakasan, Anantha P. Sodini, Charles G. Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science Chandrakasan, Anantha P. Chen, Kailiang Lee, Hae-Seung Chandrakasan, Anantha P. Sodini, Charles G. This paper demonstrates a four-channel transceiver chip for medical ultrasonic imaging, interfacing to the capacitive micromachined ultrasonic transducers (CMUTs). The high-voltage transmitter (Tx) uses a three-level pulse-shaping technique with charge recycling to improve the power efficiency. The design requires minimum off-chip components and is scalable for more channels. The receiver is implemented with a transimpedance amplifier (TIA) topology and is optimized for tradeoffs between noise, bandwidth, and power dissipation. The test chip is characterized with both acoustic and electrical measurements. Comparing the three-level pulser against traditional two-level pulsers, the measured Tx efficiency shows 56%, 50%, and 43% more acoustic power delivery with the same total power dissipation at 2.5, 3.3, and 5.0 MHz, respectively. The CMUT receiver achieves the lowest noise efficiency factor compared with that of the literature (2.1 compared to a previously reported lowest of 3.6, in units of mPA ·√(mW/Hz). In addition, the transceiver chip is tested as a complete system for medical ultrasound imaging applications, in experiments including Tx beamformation, pulse-echo channel response characterization, and ultrasonic Doppler flow rate detection. Semiconductor Research Corporation. Focus Center for Circuit and System Solutions (C2S2) 2015-02-06T15:54:25Z 2015-02-06T15:54:25Z 2013-08 2013-05 Article http://purl.org/eprint/type/JournalArticle 0018-9200 1558-173X http://hdl.handle.net/1721.1/93893 Chen, Kailiang, Hae-Seung Lee, Anantha P. Chandrakasan, and Charles G. Sodini. “Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver.” IEEE Journal of Solid-State Circuits 48, no. 11 (November 2013): 2734–2745. https://orcid.org/0000-0002-7783-0403 https://orcid.org/0000-0002-0413-8774 https://orcid.org/0000-0002-5977-2748 en_US http://dx.doi.org/10.1109/jssc.2013.2274895 IEEE Journal of Solid-State Circuits Creative Commons Attribution-Noncommercial-Share Alike http://creativecommons.org/licenses/by-nc-sa/4.0/ application/pdf Institute of Electrical and Electronics Engineers (IEEE) Chandrakasan |
| spellingShingle | Chen, Kailiang Lee, Hae-Seung Chandrakasan, Anantha P. Sodini, Charles G. Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver |
| title | Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver |
| title_full | Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver |
| title_fullStr | Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver |
| title_full_unstemmed | Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver |
| title_short | Ultrasonic Imaging Transceiver Design for CMUT: A Three-Level 30-Vpp Pulse-Shaping Pulser With Improved Efficiency and a Noise-Optimized Receiver |
| title_sort | ultrasonic imaging transceiver design for cmut a three level 30 vpp pulse shaping pulser with improved efficiency and a noise optimized receiver |
| url | http://hdl.handle.net/1721.1/93893 https://orcid.org/0000-0002-7783-0403 https://orcid.org/0000-0002-0413-8774 https://orcid.org/0000-0002-5977-2748 |
| work_keys_str_mv | AT chenkailiang ultrasonicimagingtransceiverdesignforcmutathreelevel30vpppulseshapingpulserwithimprovedefficiencyandanoiseoptimizedreceiver AT leehaeseung ultrasonicimagingtransceiverdesignforcmutathreelevel30vpppulseshapingpulserwithimprovedefficiencyandanoiseoptimizedreceiver AT chandrakasanananthap ultrasonicimagingtransceiverdesignforcmutathreelevel30vpppulseshapingpulserwithimprovedefficiencyandanoiseoptimizedreceiver AT sodinicharlesg ultrasonicimagingtransceiverdesignforcmutathreelevel30vpppulseshapingpulserwithimprovedefficiencyandanoiseoptimizedreceiver |