Contact-type mechanical interfaces for high speed digital interconnects
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1999.
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| Format: | Thesis |
| Language: | eng |
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Massachusetts Institute of Technology
2005
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| Online Access: | http://hdl.handle.net/1721.1/9404 |
| _version_ | 1826216159546966016 |
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| author | Balakrishnan, Asha, 1974- |
| author2 | Alexander Slocum. |
| author_facet | Alexander Slocum. Balakrishnan, Asha, 1974- |
| author_sort | Balakrishnan, Asha, 1974- |
| collection | MIT |
| description | Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1999. |
| first_indexed | 2024-09-23T16:43:13Z |
| format | Thesis |
| id | mit-1721.1/9404 |
| institution | Massachusetts Institute of Technology |
| language | eng |
| last_indexed | 2024-09-23T16:43:13Z |
| publishDate | 2005 |
| publisher | Massachusetts Institute of Technology |
| record_format | dspace |
| spelling | mit-1721.1/94042020-03-30T22:13:42Z Contact-type mechanical interfaces for high speed digital interconnects Balakrishnan, Asha, 1974- Alexander Slocum. Massachusetts Institute of Technology. Department of Mechanical Engineering Mechanical Engineering Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1999. Includes bibliographical references (p. 96). The objective of this work was to determine the feasibility of Ball Grid Array (BGA) planarization and to investigate the effects of mechanical contacts on signal integrity for highspeed digital signals. As devices become smaller and clock frequencies increase, new technologies for contacting devices are being developed, especially in the field of semiconductor test. These contactors will be incorporated into a socket or an interconnect used in testing devices or printed circuit boards. The heights of the solder ball leads on BGA packages have a high degree of co-planarity. As BGA pitches become tighter, the requirement for improved co-planarity persists. This thesis shows that through diamond turning techniques, the co-planarity of the solder ball leads can be improved. Planarization of solder balls enables the use and development of rigid interconnects. Interconnections generally have a built in compliance to them to accommodate for co-planarity. Reducing co-planarity eliminates the need for compliant interconnects. Contact mechanics identifies the conical shaped tip as the optimal tip shape, providing the best mechanical connection. The intent of the tip shape investigation is to correlate indentation theory with signal integrity. The electrical performance of the contactor tip is evaluated using the industry standard pogo pin. Mechanical parameters are varied to observe the effect on the signal integrity. At high frequencies, the interconnect provides a vulnerable location for signal losses to occur. A new interconnect design to address the electrical performance of existing designs is introduced. The cantilevered interconnect consists of a coplanar waveguide cross-section. The interconnect is both mechanically and electrically sound. This thesis presents aspects of mechanical contact interfaces for electrical signal testing purposes. It focuses on device interfacing, contactor tip shape, signal integrity and new interconnect designs. by Asha Balakrishnan. S.M. 2005-08-22T18:06:42Z 2005-08-22T18:06:42Z 1999 1999 Thesis http://hdl.handle.net/1721.1/9404 43181367 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 108 p. 8074600 bytes 8074358 bytes application/pdf application/pdf application/pdf Massachusetts Institute of Technology |
| spellingShingle | Mechanical Engineering Balakrishnan, Asha, 1974- Contact-type mechanical interfaces for high speed digital interconnects |
| title | Contact-type mechanical interfaces for high speed digital interconnects |
| title_full | Contact-type mechanical interfaces for high speed digital interconnects |
| title_fullStr | Contact-type mechanical interfaces for high speed digital interconnects |
| title_full_unstemmed | Contact-type mechanical interfaces for high speed digital interconnects |
| title_short | Contact-type mechanical interfaces for high speed digital interconnects |
| title_sort | contact type mechanical interfaces for high speed digital interconnects |
| topic | Mechanical Engineering |
| url | http://hdl.handle.net/1721.1/9404 |
| work_keys_str_mv | AT balakrishnanasha1974 contacttypemechanicalinterfacesforhighspeeddigitalinterconnects |