Micromechanics of the through-thickness deformation of paperboard

Micromechanics of the through-thickness deformation of paperboard

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1999.

Bibliographic Details
Main Author: Smith, Carmen Alexis
Other Authors: Mary C. Boyce and David M. Parks.
Format: Thesis
Language:eng
Published: Massachusetts Institute of Technology 2005
Subjects:
Mechanical Engineering
Online Access:http://hdl.handle.net/1721.1/9426

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