Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging
A single-phase, laminar flow, rectangular, and AlN-based micro-channel heat sink (MCHS) with water coolant has been designed and optimized for power electronics packaging. By fabricating micro-channels in the AlN-layer of direct bond copper, the heat conduction path is minimized and high cooling per...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/100180 http://hdl.handle.net/10220/17795 |
| _version_ | 1811697634039037952 |
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| author | Yin, Shan Tseng, King Jet Zhao, Jiyun |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Yin, Shan Tseng, King Jet Zhao, Jiyun |
| author_sort | Yin, Shan |
| collection | NTU |
| description | A single-phase, laminar flow, rectangular, and AlN-based micro-channel heat sink (MCHS) with water coolant has been designed and optimized for power electronics packaging. By fabricating micro-channels in the AlN-layer of direct bond copper, the heat conduction path is minimized and high cooling performance of micro-channels is utilized. The scaling effects, including temperature-dependent fluid properties, entrance effect, viscous dissipation and conjugate heat transfer, are considered. Comparison
between CFD simulation by ANSYS Fluent and well-established analytical correlations is carried out and importance of entrance effect is emphasized. For the optimal geometry, the total thermal resistance of the AlN-based MCHS is 0.128 K/W at a pressure drop of 66.6 kPa. The conventional packaging structures,
in which the Cu-based MCHS is bonded to the direct bond copper by solder or thermal interface material,
are investigated to compare with the proposed structure. The proposed structure shows a reduction in
thermal resistance by 15% and 80% respectively. |
| first_indexed | 2024-10-01T07:58:22Z |
| format | Journal Article |
| id | ntu-10356/100180 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T07:58:22Z |
| publishDate | 2013 |
| record_format | dspace |
| spelling | ntu-10356/1001802020-03-07T14:02:41Z Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging Yin, Shan Tseng, King Jet Zhao, Jiyun School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging A single-phase, laminar flow, rectangular, and AlN-based micro-channel heat sink (MCHS) with water coolant has been designed and optimized for power electronics packaging. By fabricating micro-channels in the AlN-layer of direct bond copper, the heat conduction path is minimized and high cooling performance of micro-channels is utilized. The scaling effects, including temperature-dependent fluid properties, entrance effect, viscous dissipation and conjugate heat transfer, are considered. Comparison between CFD simulation by ANSYS Fluent and well-established analytical correlations is carried out and importance of entrance effect is emphasized. For the optimal geometry, the total thermal resistance of the AlN-based MCHS is 0.128 K/W at a pressure drop of 66.6 kPa. The conventional packaging structures, in which the Cu-based MCHS is bonded to the direct bond copper by solder or thermal interface material, are investigated to compare with the proposed structure. The proposed structure shows a reduction in thermal resistance by 15% and 80% respectively. 2013-11-19T06:38:51Z 2019-12-06T20:17:55Z 2013-11-19T06:38:51Z 2019-12-06T20:17:55Z 2013 2013 Journal Article Yin, S., Tseng, K. J., & Zhao, J. (2013). Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging. Applied Thermal Engineering, 52(1), 120-129. 1359-4311 https://hdl.handle.net/10356/100180 http://hdl.handle.net/10220/17795 10.1016/j.applthermaleng.2012.11.014 en Applied thermal engineering © 2013 Elsevier. 11 p. |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging Yin, Shan Tseng, King Jet Zhao, Jiyun Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging |
| title | Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging |
| title_full | Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging |
| title_fullStr | Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging |
| title_full_unstemmed | Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging |
| title_short | Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging |
| title_sort | design of aln based micro channel heat sink in direct bond copper for power electronics packaging |
| topic | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging |
| url | https://hdl.handle.net/10356/100180 http://hdl.handle.net/10220/17795 |
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