Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging
A single-phase, laminar flow, rectangular, and AlN-based micro-channel heat sink (MCHS) with water coolant has been designed and optimized for power electronics packaging. By fabricating micro-channels in the AlN-layer of direct bond copper, the heat conduction path is minimized and high cooling per...
Main Authors: | Yin, Shan, Tseng, King Jet, Zhao, Jiyun |
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Other Authors: | School of Electrical and Electronic Engineering |
Format: | Journal Article |
Language: | English |
Published: |
2013
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/100180 http://hdl.handle.net/10220/17795 |
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