Cyber-physical management for heterogeneously integrated 3D thousand-core on-chip microprocessor
Though 3D TSV/TSI technology provides the promising platform for heterogeneous system integration with design drivers ranged from thousand-core microprocessor to millimeter-cubic sensor, the fundamental challenge is lack of light to deal with significantly increased design complexity. From device le...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/100925 http://hdl.handle.net/10220/18210 |