Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers

This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency (RF) transceiver. The microstrip patch antenna is fed by packaging interconnect components such as bond wires, signal t...

Full description

Bibliographic Details
Main Authors: Wang, Jun Jun, Zhang, Yue Ping, Chua, Kai Meng, Lu, Albert Chee Wai
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2009
Subjects:
Online Access:https://hdl.handle.net/10356/102225
http://hdl.handle.net/10220/4649
_version_ 1826113783290920960
author Wang, Jun Jun
Zhang, Yue Ping
Chua, Kai Meng
Lu, Albert Chee Wai
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Wang, Jun Jun
Zhang, Yue Ping
Chua, Kai Meng
Lu, Albert Chee Wai
author_sort Wang, Jun Jun
collection NTU
description This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency (RF) transceiver. The microstrip patch antenna is fed by packaging interconnect components such as bond wires, signal traces, and vias in a ground-signal-ground (G-S-G) configuration from the carried chip. The circuit model that consists of RLC lumped elements of both microstrip patch antenna and feeding interconnect components has been developed with an emphasis on verifying existing or deriving analytical formulas. The RLC values of the microstrip patch antenna are calculated with our improvements to existing computer-aided design formulas, while the RLC values of the feeding interconnect components are calculated with more efforts. In particular the C values related to the vias and signal traces require to be calculated numerically and they are calculated here with the method of moments and the conformal mapping method, respectively. The circuit model is validated with numerical simulations (High Frequency Structure Simulator) and network analyzer measurements.
first_indexed 2024-10-01T03:28:52Z
format Journal Article
id ntu-10356/102225
institution Nanyang Technological University
language English
last_indexed 2024-10-01T03:28:52Z
publishDate 2009
record_format dspace
spelling ntu-10356/1022252019-12-06T20:51:55Z Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers Wang, Jun Jun Zhang, Yue Ping Chua, Kai Meng Lu, Albert Chee Wai School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency (RF) transceiver. The microstrip patch antenna is fed by packaging interconnect components such as bond wires, signal traces, and vias in a ground-signal-ground (G-S-G) configuration from the carried chip. The circuit model that consists of RLC lumped elements of both microstrip patch antenna and feeding interconnect components has been developed with an emphasis on verifying existing or deriving analytical formulas. The RLC values of the microstrip patch antenna are calculated with our improvements to existing computer-aided design formulas, while the RLC values of the feeding interconnect components are calculated with more efforts. In particular the C values related to the vias and signal traces require to be calculated numerically and they are calculated here with the method of moments and the conformal mapping method, respectively. The circuit model is validated with numerical simulations (High Frequency Structure Simulator) and network analyzer measurements. Published version 2009-06-22T09:21:42Z 2019-12-06T20:51:55Z 2009-06-22T09:21:42Z 2019-12-06T20:51:55Z 2005 2005 Journal Article Wang, J. J., Zhang, Y. P., Chua, K. M., & Lu, A. C. W. (2005). Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers. IEEE Transactions on Antennas and Propagation, 53(12), 3877-3883. 0018-926X https://hdl.handle.net/10356/102225 http://hdl.handle.net/10220/4649 en IEEE transactions on antennas and propagation © 2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. 7 p. application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Wang, Jun Jun
Zhang, Yue Ping
Chua, Kai Meng
Lu, Albert Chee Wai
Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers
title Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers
title_full Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers
title_fullStr Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers
title_full_unstemmed Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers
title_short Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers
title_sort circuit model of microstrip patch antenna on ceramic land grid array package for antenna chip codesign of highly integrated rf transceivers
topic DRNTU::Engineering::Electrical and electronic engineering
url https://hdl.handle.net/10356/102225
http://hdl.handle.net/10220/4649
work_keys_str_mv AT wangjunjun circuitmodelofmicrostrippatchantennaonceramiclandgridarraypackageforantennachipcodesignofhighlyintegratedrftransceivers
AT zhangyueping circuitmodelofmicrostrippatchantennaonceramiclandgridarraypackageforantennachipcodesignofhighlyintegratedrftransceivers
AT chuakaimeng circuitmodelofmicrostrippatchantennaonceramiclandgridarraypackageforantennachipcodesignofhighlyintegratedrftransceivers
AT lualbertcheewai circuitmodelofmicrostrippatchantennaonceramiclandgridarraypackageforantennachipcodesignofhighlyintegratedrftransceivers