Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers
This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency (RF) transceiver. The microstrip patch antenna is fed by packaging interconnect components such as bond wires, signal t...
| Príomhchruthaitheoirí: | , , , |
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| Rannpháirtithe: | |
| Formáid: | Journal Article |
| Teanga: | English |
| Foilsithe / Cruthaithe: |
2009
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| Ábhair: | |
| Rochtain ar líne: | https://hdl.handle.net/10356/102225 http://hdl.handle.net/10220/4649 |
| _version_ | 1826113783290920960 |
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| author | Wang, Jun Jun Zhang, Yue Ping Chua, Kai Meng Lu, Albert Chee Wai |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Wang, Jun Jun Zhang, Yue Ping Chua, Kai Meng Lu, Albert Chee Wai |
| author_sort | Wang, Jun Jun |
| collection | NTU |
| description | This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency (RF) transceiver. The microstrip patch antenna is fed by packaging interconnect components such as bond wires, signal traces, and vias in a ground-signal-ground (G-S-G) configuration from the
carried chip. The circuit model that consists of RLC lumped elements of both microstrip patch antenna and feeding interconnect components has been developed with an emphasis on verifying existing
or deriving analytical formulas. The RLC values of the microstrip patch antenna are calculated with our improvements to
existing computer-aided design formulas, while the RLC values of the feeding interconnect components are calculated with more efforts.
In particular the C values related to the vias and signal traces require to be calculated numerically and they are calculated here with the method of moments and the conformal mapping method,
respectively. The circuit model is validated with numerical simulations (High Frequency Structure Simulator) and network analyzer
measurements. |
| first_indexed | 2024-10-01T03:28:52Z |
| format | Journal Article |
| id | ntu-10356/102225 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:28:52Z |
| publishDate | 2009 |
| record_format | dspace |
| spelling | ntu-10356/1022252019-12-06T20:51:55Z Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers Wang, Jun Jun Zhang, Yue Ping Chua, Kai Meng Lu, Albert Chee Wai School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency (RF) transceiver. The microstrip patch antenna is fed by packaging interconnect components such as bond wires, signal traces, and vias in a ground-signal-ground (G-S-G) configuration from the carried chip. The circuit model that consists of RLC lumped elements of both microstrip patch antenna and feeding interconnect components has been developed with an emphasis on verifying existing or deriving analytical formulas. The RLC values of the microstrip patch antenna are calculated with our improvements to existing computer-aided design formulas, while the RLC values of the feeding interconnect components are calculated with more efforts. In particular the C values related to the vias and signal traces require to be calculated numerically and they are calculated here with the method of moments and the conformal mapping method, respectively. The circuit model is validated with numerical simulations (High Frequency Structure Simulator) and network analyzer measurements. Published version 2009-06-22T09:21:42Z 2019-12-06T20:51:55Z 2009-06-22T09:21:42Z 2019-12-06T20:51:55Z 2005 2005 Journal Article Wang, J. J., Zhang, Y. P., Chua, K. M., & Lu, A. C. W. (2005). Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers. IEEE Transactions on Antennas and Propagation, 53(12), 3877-3883. 0018-926X https://hdl.handle.net/10356/102225 http://hdl.handle.net/10220/4649 en IEEE transactions on antennas and propagation © 2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. http://www.ieee.org/portal/site This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. 7 p. application/pdf |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering Wang, Jun Jun Zhang, Yue Ping Chua, Kai Meng Lu, Albert Chee Wai Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers |
| title | Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers |
| title_full | Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers |
| title_fullStr | Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers |
| title_full_unstemmed | Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers |
| title_short | Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers |
| title_sort | circuit model of microstrip patch antenna on ceramic land grid array package for antenna chip codesign of highly integrated rf transceivers |
| topic | DRNTU::Engineering::Electrical and electronic engineering |
| url | https://hdl.handle.net/10356/102225 http://hdl.handle.net/10220/4649 |
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