Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn–Ag–Cu (SAC) solder matrix, to form composite solders. Up to 0.05 wt.% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au finished...
| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2013
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/102285 http://hdl.handle.net/10220/16866 |
| _version_ | 1811678763957616640 |
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| author | Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming |
| author2 | School of Electrical and Electronic Engineering |
| author_facet | School of Electrical and Electronic Engineering Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming |
| author_sort | Nai, S. M. L. |
| collection | NTU |
| description | In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn–Ag–Cu (SAC) solder matrix, to form composite solders. Up to 0.05 wt.% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au finished Cu substrates were investigated after thermal cycling (from −40 °C to +125 °C) for up to 2000 cycles. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Results also revealed that after soldering and thermal cycling, the interfacial IMC thickness of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Shear tests results revealed that both composite solder joints which were thermally cycled and as-soldered had better ultimate shear strength than their monolithic counterparts. The shear strength of all thermally cycled solder joints decreased with increasing thermal cycles. |
| first_indexed | 2024-10-01T02:58:26Z |
| format | Journal Article |
| id | ntu-10356/102285 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T02:58:26Z |
| publishDate | 2013 |
| record_format | dspace |
| spelling | ntu-10356/1022852020-03-07T12:47:12Z Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming School of Electrical and Electronic Engineering A*STAR SIMTech DRNTU::Engineering::Electrical and electronic engineering In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn–Ag–Cu (SAC) solder matrix, to form composite solders. Up to 0.05 wt.% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au finished Cu substrates were investigated after thermal cycling (from −40 °C to +125 °C) for up to 2000 cycles. The thermomechanical property results showed an improvement in thermal stability for the composite solders. Results also revealed that after soldering and thermal cycling, the interfacial IMC thickness of the unreinforced solder joint was observed to grow more significantly than that of the composite solder joints. Shear tests results revealed that both composite solder joints which were thermally cycled and as-soldered had better ultimate shear strength than their monolithic counterparts. The shear strength of all thermally cycled solder joints decreased with increasing thermal cycles. 2013-10-25T01:33:23Z 2019-12-06T20:52:39Z 2013-10-25T01:33:23Z 2019-12-06T20:52:39Z 2012 2012 Journal Article Han, Y., Jing, H., Nai, S. M. L., Xu, L. Y., Tan, C. M., & Wei, J. (2012). Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling. Intermetallics, 31, 72-78. 0966-9795 https://hdl.handle.net/10356/102285 http://hdl.handle.net/10220/16866 10.1016/j.intermet.2012.06.002 en Intermetallics |
| spellingShingle | DRNTU::Engineering::Electrical and electronic engineering Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling |
| title | Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling |
| title_full | Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling |
| title_fullStr | Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling |
| title_full_unstemmed | Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling |
| title_short | Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling |
| title_sort | interfacial reaction and shear strength of ni coated carbon nanotubes reinforced sn ag cu solder joints during thermal cycling |
| topic | DRNTU::Engineering::Electrical and electronic engineering |
| url | https://hdl.handle.net/10356/102285 http://hdl.handle.net/10220/16866 |
| work_keys_str_mv | AT naisml interfacialreactionandshearstrengthofnicoatedcarbonnanotubesreinforcedsnagcusolderjointsduringthermalcycling AT xuly interfacialreactionandshearstrengthofnicoatedcarbonnanotubesreinforcedsnagcusolderjointsduringthermalcycling AT weij interfacialreactionandshearstrengthofnicoatedcarbonnanotubesreinforcedsnagcusolderjointsduringthermalcycling AT hanyongdian interfacialreactionandshearstrengthofnicoatedcarbonnanotubesreinforcedsnagcusolderjointsduringthermalcycling AT jinghongyang interfacialreactionandshearstrengthofnicoatedcarbonnanotubesreinforcedsnagcusolderjointsduringthermalcycling AT tancherming interfacialreactionandshearstrengthofnicoatedcarbonnanotubesreinforcedsnagcusolderjointsduringthermalcycling |