Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating
In this research, the interactions of SnInAg solder on Kovar leadframes (Fe29Ni17Co) with Au/Ni UMB was studied, to reveal the whiskers growth mechanism. Samples were prepared by reflow process and aging, with SnInAg solder paste on the substrate. Scanning electron microscope was used to observe the...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/102482 http://hdl.handle.net/10220/24288 |