Thermal test effect on fan-out wafer level package strength
Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the pro...
| Main Authors: | , , |
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| Format: | Conference Paper |
| Language: | English |
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2018
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| Online Access: | https://hdl.handle.net/10356/102486 http://hdl.handle.net/10220/47256 |
| _version_ | 1824454355394232320 |
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| author | Xu, Cheng Zhong, Zhao Wei Choi, W. K. |
| author2 | School of Mechanical and Aerospace Engineering |
| author_facet | School of Mechanical and Aerospace Engineering Xu, Cheng Zhong, Zhao Wei Choi, W. K. |
| author_sort | Xu, Cheng |
| collection | NTU |
| description | Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the proper structural design and material selection are essential to achieve reliability requirements. In this study, FOWLP material especially the epoxy molding compound (EMC) thermal properties are evaluated to understand the effect of thermal factors on EMC strength. The long term thermal test is applied and the EMC flexure strength increases significantly after the high temperature storage test. |
| first_indexed | 2025-02-19T03:21:00Z |
| format | Conference Paper |
| id | ntu-10356/102486 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2025-02-19T03:21:00Z |
| publishDate | 2018 |
| record_format | dspace |
| spelling | ntu-10356/1024862023-03-04T17:08:08Z Thermal test effect on fan-out wafer level package strength Xu, Cheng Zhong, Zhao Wei Choi, W. K. School of Mechanical and Aerospace Engineering 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Curing Electromagnetic Compatibility DRNTU::Engineering::Mechanical engineering Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the proper structural design and material selection are essential to achieve reliability requirements. In this study, FOWLP material especially the epoxy molding compound (EMC) thermal properties are evaluated to understand the effect of thermal factors on EMC strength. The long term thermal test is applied and the EMC flexure strength increases significantly after the high temperature storage test. Published version 2018-12-27T07:45:22Z 2019-12-06T20:55:39Z 2018-12-27T07:45:22Z 2019-12-06T20:55:39Z 2018 Conference Paper Xu, C., Zhong, Z. W., & Choi, W. K. (2017). Thermal test effect on fan-out wafer level package strength. 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017, 271-274. doi: 10.1109/IMPACT.2017.8255915 https://hdl.handle.net/10356/102486 http://hdl.handle.net/10220/47256 10.1109/IMPACT.2017.8255915 en © 2017 IEEE. Translations and content mining are permitted for academic research only. Personal use is also permitted, but republication/redistribution requires IEEE permission. See http://www.ieee.org/publications_standards/publications/rights/index.html for more information. 4 p. application/pdf |
| spellingShingle | Curing Electromagnetic Compatibility DRNTU::Engineering::Mechanical engineering Xu, Cheng Zhong, Zhao Wei Choi, W. K. Thermal test effect on fan-out wafer level package strength |
| title | Thermal test effect on fan-out wafer level package strength |
| title_full | Thermal test effect on fan-out wafer level package strength |
| title_fullStr | Thermal test effect on fan-out wafer level package strength |
| title_full_unstemmed | Thermal test effect on fan-out wafer level package strength |
| title_short | Thermal test effect on fan-out wafer level package strength |
| title_sort | thermal test effect on fan out wafer level package strength |
| topic | Curing Electromagnetic Compatibility DRNTU::Engineering::Mechanical engineering |
| url | https://hdl.handle.net/10356/102486 http://hdl.handle.net/10220/47256 |
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