Thermal test effect on fan-out wafer level package strength
Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a very small form factor and it is also a cost effective packaging solution. As fan-out wafer level package (FOWLP) is composed of various materials, the pro...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2018
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/102486 http://hdl.handle.net/10220/47256 |