Customized glass sealant for ceramic substrates for high temperature electronic application
This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength measurements were carried out at both room and high temperature (i.e. 250 °C) to...
| Main Authors: | , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/102501 http://hdl.handle.net/10220/24287 |
| _version_ | 1824456180638941184 |
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| author | Sharif, Ahmed Gan, Chee Lip Chen, Zhong |
| author2 | School of Materials Science & Engineering |
| author_facet | School of Materials Science & Engineering Sharif, Ahmed Gan, Chee Lip Chen, Zhong |
| author_sort | Sharif, Ahmed |
| collection | NTU |
| description | This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength measurements were carried out at both room and high temperature (i.e. 250 °C) to evaluate room and high temperature performance of the joints. The glass joints in both the Al2O3/glass/Al2O3 and AlN/glass/AlN systems maintained their integrity even when shear-tested at 250 °C. The results of the mechanical and microstructural characterizations demonstrate that Bi-based two phase glass frit bonding is an effective ceramic bonding method for harsh-environment electronic packaging. |
| first_indexed | 2025-02-19T03:50:00Z |
| format | Journal Article |
| id | ntu-10356/102501 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2025-02-19T03:50:00Z |
| publishDate | 2014 |
| record_format | dspace |
| spelling | ntu-10356/1025012023-07-14T15:46:10Z Customized glass sealant for ceramic substrates for high temperature electronic application Sharif, Ahmed Gan, Chee Lip Chen, Zhong School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials This study investigates the ceramic to ceramic bonding, using composite glass frit as the binding layer that is able to tolerate a high temperature environment for ruggedized microelectronic applications. Shear strength measurements were carried out at both room and high temperature (i.e. 250 °C) to evaluate room and high temperature performance of the joints. The glass joints in both the Al2O3/glass/Al2O3 and AlN/glass/AlN systems maintained their integrity even when shear-tested at 250 °C. The results of the mechanical and microstructural characterizations demonstrate that Bi-based two phase glass frit bonding is an effective ceramic bonding method for harsh-environment electronic packaging. Accepted version 2014-12-02T08:08:51Z 2019-12-06T20:55:58Z 2014-12-02T08:08:51Z 2019-12-06T20:55:58Z 2014 2014 Journal Article Sharif, A., Gan, C. L., & Chen, Z. (2014). Customized glass sealant for ceramic substrates for high temperature electronic application. Microelectronics reliability, 54(12), 2905-2910. 0026-2714 https://hdl.handle.net/10356/102501 http://hdl.handle.net/10220/24287 10.1016/j.microrel.2014.07.005 en Microelectronics reliability © 2014 Elsevier Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Microelectronics reliability, Elsevier Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.microrel.2014.07.005]. application/pdf |
| spellingShingle | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials Sharif, Ahmed Gan, Chee Lip Chen, Zhong Customized glass sealant for ceramic substrates for high temperature electronic application |
| title | Customized glass sealant for ceramic substrates for high temperature electronic application |
| title_full | Customized glass sealant for ceramic substrates for high temperature electronic application |
| title_fullStr | Customized glass sealant for ceramic substrates for high temperature electronic application |
| title_full_unstemmed | Customized glass sealant for ceramic substrates for high temperature electronic application |
| title_short | Customized glass sealant for ceramic substrates for high temperature electronic application |
| title_sort | customized glass sealant for ceramic substrates for high temperature electronic application |
| topic | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials |
| url | https://hdl.handle.net/10356/102501 http://hdl.handle.net/10220/24287 |
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