Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters
Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. In recent years, palladium-coated copper (PdCu) w...
| Main Authors: | , , , , , |
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| Outros autores: | |
| Formato: | Journal Article |
| Idioma: | English |
| Publicado: |
2014
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| Subjects: | |
| Acceso en liña: | https://hdl.handle.net/10356/102892 http://hdl.handle.net/10220/24289 |