Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation

Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation

The voids formed in the Ni3P layer during reaction between Sn-based solders and electroless Ni–P metallization is an important cause of rapid degradation of solder joint reliability. In this study, to suppress formation of the Ni3P phase, an electrolessly plated Ni–Sn–P alloy (6–7 wt.% P and 19–21 w...

Бүрэн тодорхойлолт

Номзүйн дэлгэрэнгүй
Үндсэн зохиолчид:	Yang, Ying, Balaraju, J. N., Huang, Yizhong, Tay, Yee Yan, Shen, Yiqiang, Tsakadze, Zviad, Chen, Zhong
Бусад зохиолчид:	School of Materials Science & Engineering
Формат:	Journal Article
Хэл сонгох:	English
Хэвлэсэн:	2014
Нөхцлүүд:	DRNTU::Engineering::Materials::Electronic packaging materials
Онлайн хандалт:	https://hdl.handle.net/10356/102898 http://hdl.handle.net/10220/24285

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