A new creep model for SnAgCu lead-free composite solders : incorporating back stress
The paper presents improved constitutive models for SnAgCu solder. In the present study, the constitutive behavior for creep performance of 95.8Sn-3.5Ag-0.7Cu lead-free solder was investigated. The secondary creep stage was focused on. It is shown that the stress exponent n can be well-defined into...
| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/103336 http://hdl.handle.net/10220/6383 |