High frequency electrical properties of copper interconnects patterned by resolution enhanced lithography
Signal integrity problems associated with on-chip interconnects have become very significant with increase in device integration and circuit frequency. Copper and low-κ dielectric materials are used to improve electrical performance of interconnects for integrated circuits. At radio and microwave fr...
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| Format: | Thesis |
| Language: | English |
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2008
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| Online Access: | https://hdl.handle.net/10356/13115 |