Fabrication & characterization of high aspect ratio fine pitch deep reactive ion etched through-wafer electroplated copper interconnects
In recent years, through-wafer interconnects have emerged as a critical component required in the fabrication of the next generation of 3-D consumer electronic devices, which will have faster signal processing speed, ultra high I/Os density, smaller foot-print area, improved electrical and thermo-me...
Main Author: | Dixit, Pradeep |
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Other Authors: | Miao Jianmin |
Format: | Thesis |
Language: | English |
Published: |
2008
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/13519 |
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