Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation
Stretchable conductors are the basic units of advanced flexible electronic devices, such as skin‐like sensors, stretchable batteries and soft actuators. Current fabrication strategies are mainly focused on the stretchability of the conductor with less emphasis on the huge mismatch of the conductive...
| Main Authors: | , , , , , , , , , , , , , , , , , , , |
|---|---|
| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2020
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/137870 |
| _version_ | 1826111766663266304 |
|---|---|
| author | Liu, Zhiyuan Wang, Hui Huang, Pingao Huang, Jianping Zhang, Yu Wang, Yuanyuan Yu, Mei Chen, Shixiong Qi, Dianpeng Wang, Ting Jiang, Ying Chen, Geng Hu, Guoyu Li, Wenlong Yu, Jiancan Luo, Yifei Loh, Xian Jun Liedberg, Bo Li, Guanglin Chen, Xiaodong |
| author2 | School of Materials Science & Engineering |
| author_facet | School of Materials Science & Engineering Liu, Zhiyuan Wang, Hui Huang, Pingao Huang, Jianping Zhang, Yu Wang, Yuanyuan Yu, Mei Chen, Shixiong Qi, Dianpeng Wang, Ting Jiang, Ying Chen, Geng Hu, Guoyu Li, Wenlong Yu, Jiancan Luo, Yifei Loh, Xian Jun Liedberg, Bo Li, Guanglin Chen, Xiaodong |
| author_sort | Liu, Zhiyuan |
| collection | NTU |
| description | Stretchable conductors are the basic units of advanced flexible electronic devices, such as skin‐like sensors, stretchable batteries and soft actuators. Current fabrication strategies are mainly focused on the stretchability of the conductor with less emphasis on the huge mismatch of the conductive material and polymeric substrate, which results in stability issues during long‐term use. Thermal‐radiation‐assisted metal encapsulation is reported to construct an interlocking layer between polydimethylsiloxane (PDMS) and gold by employing a semipolymerized PDMS substrate to encapsulate the gold clusters/atoms during thermal deposition. The stability of the stretchable conductor is significantly enhanced based on the interlocking effect of metal and polymer, with high interfacial adhesion (>2 MPa) and cyclic stability (>10 000 cycles). Also, the conductor exhibits superior properties such as high stretchability (>130%) and large active surface area (>5:1 effective surface area/geometrical area). It is noted that this method can be easily used to fabricate such a stretchable conductor in a wafer‐scale format through a one‐step process. As a proof of concept, both long‐term implantation in an animal model to monitor intramuscular electric signals and on human skin for detection of biosignals are demonstrated. This design approach brings about a new perspective on the exploration of stretchable conductors for biomedical applications. |
| first_indexed | 2024-10-01T02:56:11Z |
| format | Journal Article |
| id | ntu-10356/137870 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T02:56:11Z |
| publishDate | 2020 |
| record_format | dspace |
| spelling | ntu-10356/1378702023-07-14T15:56:33Z Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation Liu, Zhiyuan Wang, Hui Huang, Pingao Huang, Jianping Zhang, Yu Wang, Yuanyuan Yu, Mei Chen, Shixiong Qi, Dianpeng Wang, Ting Jiang, Ying Chen, Geng Hu, Guoyu Li, Wenlong Yu, Jiancan Luo, Yifei Loh, Xian Jun Liedberg, Bo Li, Guanglin Chen, Xiaodong School of Materials Science & Engineering Innovative Centre for Flexible Devices (iFLEX) Max Planck-NTU Joint Lab for Artificial Senses Engineering::Materials Adhesion Interlocking Effect Stretchable conductors are the basic units of advanced flexible electronic devices, such as skin‐like sensors, stretchable batteries and soft actuators. Current fabrication strategies are mainly focused on the stretchability of the conductor with less emphasis on the huge mismatch of the conductive material and polymeric substrate, which results in stability issues during long‐term use. Thermal‐radiation‐assisted metal encapsulation is reported to construct an interlocking layer between polydimethylsiloxane (PDMS) and gold by employing a semipolymerized PDMS substrate to encapsulate the gold clusters/atoms during thermal deposition. The stability of the stretchable conductor is significantly enhanced based on the interlocking effect of metal and polymer, with high interfacial adhesion (>2 MPa) and cyclic stability (>10 000 cycles). Also, the conductor exhibits superior properties such as high stretchability (>130%) and large active surface area (>5:1 effective surface area/geometrical area). It is noted that this method can be easily used to fabricate such a stretchable conductor in a wafer‐scale format through a one‐step process. As a proof of concept, both long‐term implantation in an animal model to monitor intramuscular electric signals and on human skin for detection of biosignals are demonstrated. This design approach brings about a new perspective on the exploration of stretchable conductors for biomedical applications. NRF (Natl Research Foundation, S’pore) ASTAR (Agency for Sci., Tech. and Research, S’pore) Accepted version 2020-04-17T01:51:42Z 2020-04-17T01:51:42Z 2019 Journal Article Liu, Z., Wang, H., Huang, P., Huang, J., Zhang, Y., Wang, Y., . . . Chen, X. (2019). Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation. Advanced materials, 31(35), 1901360-. doi:10.1002/adma.201901360 0935-9648 https://hdl.handle.net/10356/137870 10.1002/adma.201901360 31282042 2-s2.0-85068690636 35 31 en Advanced materials This is the peer reviewed version of the following article: Liu, Z., Wang, H., Huang, P., Huang, J., Zhang, Y., Wang, Y., . . . Chen, X. (2019). Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation. Advanced materials, 31(35), 1901360-. doi:10.1002/adma.201901360, which has been published in final form at https://doi.org/10.1002/adma.201901360. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions. application/pdf |
| spellingShingle | Engineering::Materials Adhesion Interlocking Effect Liu, Zhiyuan Wang, Hui Huang, Pingao Huang, Jianping Zhang, Yu Wang, Yuanyuan Yu, Mei Chen, Shixiong Qi, Dianpeng Wang, Ting Jiang, Ying Chen, Geng Hu, Guoyu Li, Wenlong Yu, Jiancan Luo, Yifei Loh, Xian Jun Liedberg, Bo Li, Guanglin Chen, Xiaodong Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation |
| title | Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation |
| title_full | Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation |
| title_fullStr | Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation |
| title_full_unstemmed | Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation |
| title_short | Highly stable and stretchable conductive films through thermal‐radiation‐assisted metal encapsulation |
| title_sort | highly stable and stretchable conductive films through thermal radiation assisted metal encapsulation |
| topic | Engineering::Materials Adhesion Interlocking Effect |
| url | https://hdl.handle.net/10356/137870 |
| work_keys_str_mv | AT liuzhiyuan highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT wanghui highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT huangpingao highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT huangjianping highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT zhangyu highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT wangyuanyuan highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT yumei highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT chenshixiong highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT qidianpeng highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT wangting highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT jiangying highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT chengeng highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT huguoyu highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT liwenlong highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT yujiancan highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT luoyifei highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT lohxianjun highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT liedbergbo highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT liguanglin highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation AT chenxiaodong highlystableandstretchableconductivefilmsthroughthermalradiationassistedmetalencapsulation |