EEE bond : an Android-based mobile application for better bonding among juniors and seniors
With the trend in technology advancement, mobile applications in the market have offered abundant of features to suit individuals and organizations’ needs, hence phone users are spending more time using their phones. In this project, a mobile application is proposed and developed to provide a social...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Final Year Project (FYP) |
| Language: | English |
| Published: |
Nanyang Technological University
2020
|
| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/140149 |
| _version_ | 1826124741519343616 |
|---|---|
| author | Tey, Zhi Yong |
| author2 | Shao Xuguang, Michelle |
| author_facet | Shao Xuguang, Michelle Tey, Zhi Yong |
| author_sort | Tey, Zhi Yong |
| collection | NTU |
| description | With the trend in technology advancement, mobile applications in the market have offered abundant of features to suit individuals and organizations’ needs, hence phone users are spending more time using their phones. In this project, a mobile application is proposed and developed to provide a social based mobile application to better connect the students in the same faculty. The application allows students to look for seniors and juniors and sending buddy request while having updates of school events. The design and development process of the application are outlined in this report. The main programming languages applied in the project are Java, XML and Javascript. Firebase is used for data storage and management purposes. The application provides essential sets of features to work seamlessly. Further implementation can be further investigate to for more potential use of the application while improving its efficiency. |
| first_indexed | 2024-10-01T06:25:21Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/140149 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:25:21Z |
| publishDate | 2020 |
| publisher | Nanyang Technological University |
| record_format | dspace |
| spelling | ntu-10356/1401492023-07-07T18:39:35Z EEE bond : an Android-based mobile application for better bonding among juniors and seniors Tey, Zhi Yong Shao Xuguang, Michelle School of Electrical and Electronic Engineering xgshao@ntu.edu.sg Engineering::Electrical and electronic engineering::Computer hardware, software and systems With the trend in technology advancement, mobile applications in the market have offered abundant of features to suit individuals and organizations’ needs, hence phone users are spending more time using their phones. In this project, a mobile application is proposed and developed to provide a social based mobile application to better connect the students in the same faculty. The application allows students to look for seniors and juniors and sending buddy request while having updates of school events. The design and development process of the application are outlined in this report. The main programming languages applied in the project are Java, XML and Javascript. Firebase is used for data storage and management purposes. The application provides essential sets of features to work seamlessly. Further implementation can be further investigate to for more potential use of the application while improving its efficiency. Bachelor of Engineering (Electrical and Electronic Engineering) 2020-05-27T02:38:38Z 2020-05-27T02:38:38Z 2020 Final Year Project (FYP) https://hdl.handle.net/10356/140149 en A3204-191 application/pdf Nanyang Technological University |
| spellingShingle | Engineering::Electrical and electronic engineering::Computer hardware, software and systems Tey, Zhi Yong EEE bond : an Android-based mobile application for better bonding among juniors and seniors |
| title | EEE bond : an Android-based mobile application for better bonding among juniors and seniors |
| title_full | EEE bond : an Android-based mobile application for better bonding among juniors and seniors |
| title_fullStr | EEE bond : an Android-based mobile application for better bonding among juniors and seniors |
| title_full_unstemmed | EEE bond : an Android-based mobile application for better bonding among juniors and seniors |
| title_short | EEE bond : an Android-based mobile application for better bonding among juniors and seniors |
| title_sort | eee bond an android based mobile application for better bonding among juniors and seniors |
| topic | Engineering::Electrical and electronic engineering::Computer hardware, software and systems |
| url | https://hdl.handle.net/10356/140149 |
| work_keys_str_mv | AT teyzhiyong eeebondanandroidbasedmobileapplicationforbetterbondingamongjuniorsandseniors |