Metallic nanoparticle inks for 3D printing of electronics
The three‐dimensional (3D) printed electronics additive manufacturing industry sector has grown substantially in the past few years, and there is increasing demand for different types of metallic nanoparticle inks in electronics printing for various applications. Metallic nanoparticle inks are commo...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2020
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| Online Access: | https://hdl.handle.net/10356/141374 |
| _version_ | 1826127882880024576 |
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| author | Tan, Hong Wei An, Jia Chua, Chee Kai Tran, Tuan |
| author2 | School of Mechanical and Aerospace Engineering |
| author_facet | School of Mechanical and Aerospace Engineering Tan, Hong Wei An, Jia Chua, Chee Kai Tran, Tuan |
| author_sort | Tan, Hong Wei |
| collection | NTU |
| description | The three‐dimensional (3D) printed electronics additive manufacturing industry sector has grown substantially in the past few years, and there is increasing demand for different types of metallic nanoparticle inks in electronics printing for various applications. Metallic nanoparticle inks are commonly used for fabricating conductive tracks and patterns due to their relatively high electrical conductivity as compared to other types of inks, and they can be further categorized into single‐element metallic nanoparticle inks, alloy metallic nanoparticle inks, metallic oxide nanoparticle inks, and core–shell bimetallic nanoparticle (BNP) inks. It is critical to gain a deep understanding of the metallic nanoparticle inks used in 3D printed electronics as the material properties of these inks can directly affect the final electrical and mechanical properties of the printed patterns. This review presents an overview of the available metallic nanoparticle inks used for 3D printing of electronics, and critically reviews the strengths and weaknesses of each type of ink. Finally, the challenges of metallic nanoparticle inks in 3D printed electronics are also discussed along with the future outlook for 3D printed electronics. |
| first_indexed | 2024-10-01T07:16:08Z |
| format | Journal Article |
| id | ntu-10356/141374 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T07:16:08Z |
| publishDate | 2020 |
| record_format | dspace |
| spelling | ntu-10356/1413742020-09-26T22:07:38Z Metallic nanoparticle inks for 3D printing of electronics Tan, Hong Wei An, Jia Chua, Chee Kai Tran, Tuan School of Mechanical and Aerospace Engineering Singapore Centre for 3D Printing Engineering::Mechanical engineering 3D Printing 3D Printed Electronics The three‐dimensional (3D) printed electronics additive manufacturing industry sector has grown substantially in the past few years, and there is increasing demand for different types of metallic nanoparticle inks in electronics printing for various applications. Metallic nanoparticle inks are commonly used for fabricating conductive tracks and patterns due to their relatively high electrical conductivity as compared to other types of inks, and they can be further categorized into single‐element metallic nanoparticle inks, alloy metallic nanoparticle inks, metallic oxide nanoparticle inks, and core–shell bimetallic nanoparticle (BNP) inks. It is critical to gain a deep understanding of the metallic nanoparticle inks used in 3D printed electronics as the material properties of these inks can directly affect the final electrical and mechanical properties of the printed patterns. This review presents an overview of the available metallic nanoparticle inks used for 3D printing of electronics, and critically reviews the strengths and weaknesses of each type of ink. Finally, the challenges of metallic nanoparticle inks in 3D printed electronics are also discussed along with the future outlook for 3D printed electronics. Accepted version This research was supported by the National Research Foundation, Prime Minister’s Office, Singapore under its Medium-Sized Centre funding scheme. H.W.T. acknowledges the Nanyang President’s Graduate Scholarship (NPGS). 2020-06-08T03:27:06Z 2020-06-08T03:27:06Z 2019 Journal Article Tan, H. W., An, J., Chua, C. K., & Tran, T. (2019). Metallic nanoparticle inks for 3D printing of electronics. Advanced Electronic Materials, 5(5), 1800831-. doi:10.1002/aelm.201800831 2199-160X https://hdl.handle.net/10356/141374 10.1002/aelm.201800831 2-s2.0-85063565779 5 5 en Advanced Electronic Materials This is the accepted version of the following article: Tan, H. W., An, J., Chua, C. K., & Tran, T. (2019). Metallic nanoparticle inks for 3D printing of electronics. Advanced Electronic Materials, 5(5), 1800831-, which has been published in final form at http://dx.doi.org/10.1002/aelm.201800831. This article may be used for non-commercial purposes in accordance with the Wiley Self-Archiving Policy [https://authorservices.wiley.com/authorresources/Journal-Authors/licensing/self-archiving.html]. application/pdf |
| spellingShingle | Engineering::Mechanical engineering 3D Printing 3D Printed Electronics Tan, Hong Wei An, Jia Chua, Chee Kai Tran, Tuan Metallic nanoparticle inks for 3D printing of electronics |
| title | Metallic nanoparticle inks for 3D printing of electronics |
| title_full | Metallic nanoparticle inks for 3D printing of electronics |
| title_fullStr | Metallic nanoparticle inks for 3D printing of electronics |
| title_full_unstemmed | Metallic nanoparticle inks for 3D printing of electronics |
| title_short | Metallic nanoparticle inks for 3D printing of electronics |
| title_sort | metallic nanoparticle inks for 3d printing of electronics |
| topic | Engineering::Mechanical engineering 3D Printing 3D Printed Electronics |
| url | https://hdl.handle.net/10356/141374 |
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