Packaging and instrumentation data acquisition
With the need for newer materials being utilised to substitute the over reliance of common materials, more kinds of materials are being used. Some of these materials are still relatively new in discovery, thus their properties are still unknown. The plan for this project is to find out the thermoele...
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| Format: | Final Year Project (FYP) |
| Language: | English |
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Nanyang Technological University
2020
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| Online Access: | https://hdl.handle.net/10356/141800 |
| _version_ | 1826112507914223616 |
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| author | Lee, Maverick Xian Zheng |
| author2 | Hong Li |
| author_facet | Hong Li Lee, Maverick Xian Zheng |
| author_sort | Lee, Maverick Xian Zheng |
| collection | NTU |
| description | With the need for newer materials being utilised to substitute the over reliance of common materials, more kinds of materials are being used. Some of these materials are still relatively new in discovery, thus their properties are still unknown. The plan for this project is to find out the thermoelectric properties of some of these materials by using a Janis Cryostat.
It has been shown through past research that thermoelectric materials can increase energy efficiency. In today’s world, an apparent challenge that humans need to solve is the energy crisis, where fossil fuel reserves are being depleted. Thermoelectric materials can be used to develop new cooling methods and help to convert waste heat energy into electrical energy.
The project involves the use of a sample holder secured to the Janis Cryostat. This sample holder would hold the chip containing the different materials and this whole setup would be tested under a temperature range from 77K to 700K. Through these tests, the Seebeck Coefficient and Electrical Conductivity of these materials would be studied for practical usage. The system must be electrically insulative, thermally conductive and physically durable. From this project, hopefully thermoelectric properties of some of these materials would be found. |
| first_indexed | 2024-10-01T03:08:11Z |
| format | Final Year Project (FYP) |
| id | ntu-10356/141800 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T03:08:11Z |
| publishDate | 2020 |
| publisher | Nanyang Technological University |
| record_format | dspace |
| spelling | ntu-10356/1418002023-03-04T19:30:40Z Packaging and instrumentation data acquisition Lee, Maverick Xian Zheng Hong Li School of Mechanical and Aerospace Engineering ehongli@ntu.edu.sg Engineering::Mechanical engineering With the need for newer materials being utilised to substitute the over reliance of common materials, more kinds of materials are being used. Some of these materials are still relatively new in discovery, thus their properties are still unknown. The plan for this project is to find out the thermoelectric properties of some of these materials by using a Janis Cryostat. It has been shown through past research that thermoelectric materials can increase energy efficiency. In today’s world, an apparent challenge that humans need to solve is the energy crisis, where fossil fuel reserves are being depleted. Thermoelectric materials can be used to develop new cooling methods and help to convert waste heat energy into electrical energy. The project involves the use of a sample holder secured to the Janis Cryostat. This sample holder would hold the chip containing the different materials and this whole setup would be tested under a temperature range from 77K to 700K. Through these tests, the Seebeck Coefficient and Electrical Conductivity of these materials would be studied for practical usage. The system must be electrically insulative, thermally conductive and physically durable. From this project, hopefully thermoelectric properties of some of these materials would be found. Bachelor of Engineering (Mechanical Engineering) 2020-06-11T00:49:53Z 2020-06-11T00:49:53Z 2020 Final Year Project (FYP) https://hdl.handle.net/10356/141800 en application/pdf Nanyang Technological University |
| spellingShingle | Engineering::Mechanical engineering Lee, Maverick Xian Zheng Packaging and instrumentation data acquisition |
| title | Packaging and instrumentation data acquisition |
| title_full | Packaging and instrumentation data acquisition |
| title_fullStr | Packaging and instrumentation data acquisition |
| title_full_unstemmed | Packaging and instrumentation data acquisition |
| title_short | Packaging and instrumentation data acquisition |
| title_sort | packaging and instrumentation data acquisition |
| topic | Engineering::Mechanical engineering |
| url | https://hdl.handle.net/10356/141800 |
| work_keys_str_mv | AT leemaverickxianzheng packagingandinstrumentationdataacquisition |