Thermal design optimization of evaporator micropillar wicks

Heat pipes and vapor chambers act as efficient heat spreaders since they rely on phase change of the coolant. The evaporator design is critical and typically high performance is characterized by the high heat dissipation capability with low thermal resistance. In the past, there have been numerous e...

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Main Authors: Somasundaram, Sivanand, Zhu, Yangying, Lu, Zhengmao, Adera, Solomon, Bin, He, Mengyao, Wei, Tan, Chuan Seng, Wang, Evelyn N.
Other Authors: School of Electrical and Electronic Engineering
Format: Journal Article
Language:English
Published: 2020
Subjects:
Online Access:https://hdl.handle.net/10356/142783
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author Somasundaram, Sivanand
Zhu, Yangying
Lu, Zhengmao
Adera, Solomon
Bin, He
Mengyao, Wei
Tan, Chuan Seng
Wang, Evelyn N.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Somasundaram, Sivanand
Zhu, Yangying
Lu, Zhengmao
Adera, Solomon
Bin, He
Mengyao, Wei
Tan, Chuan Seng
Wang, Evelyn N.
author_sort Somasundaram, Sivanand
collection NTU
description Heat pipes and vapor chambers act as efficient heat spreaders since they rely on phase change of the coolant. The evaporator design is critical and typically high performance is characterized by the high heat dissipation capability with low thermal resistance. In the past, there have been numerous experimental and modeling studies focused on the design of evaporator wicks of different geometries, but systematic studies to simultaneously optimize both the heat flux and thermal resistance have been limited. In this work, we developed a comprehensive model that considers both aspects to provide design guidelines for evaporator micropillar wicks. We show that capillary limited heat dissipation is best captured with a recently developed numerical model as compared to previous analytical models. We also developed a numerical model to obtain the effective wick thermal conductivity, which is a function of pillar diameter, pitch, and height. Smaller diameters with smaller pitches of the pillars had more thin film area and had larger effective wick thermal conductivities. Our parametric investigations show that trade-offs between lowest thermal resistance and maximum heat carrying load exists, and the actual wick geometry will be dictated by application specific requirements. Finally, we highlight the importance of accurately obtaining the accommodation coefficients to predict the effective wick thermal conductivity. The present work would enable in optimal design of micropillar wicks (with low thermal resistance and high dry-out heat flux) and the same methodology can be extended to other types of wick structures as well.
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spelling ntu-10356/1427832020-06-30T06:17:25Z Thermal design optimization of evaporator micropillar wicks Somasundaram, Sivanand Zhu, Yangying Lu, Zhengmao Adera, Solomon Bin, He Mengyao, Wei Tan, Chuan Seng Wang, Evelyn N. School of Electrical and Electronic Engineering Engineering::Electrical and electronic engineering Vapor Chambers Evaporator Heat pipes and vapor chambers act as efficient heat spreaders since they rely on phase change of the coolant. The evaporator design is critical and typically high performance is characterized by the high heat dissipation capability with low thermal resistance. In the past, there have been numerous experimental and modeling studies focused on the design of evaporator wicks of different geometries, but systematic studies to simultaneously optimize both the heat flux and thermal resistance have been limited. In this work, we developed a comprehensive model that considers both aspects to provide design guidelines for evaporator micropillar wicks. We show that capillary limited heat dissipation is best captured with a recently developed numerical model as compared to previous analytical models. We also developed a numerical model to obtain the effective wick thermal conductivity, which is a function of pillar diameter, pitch, and height. Smaller diameters with smaller pitches of the pillars had more thin film area and had larger effective wick thermal conductivities. Our parametric investigations show that trade-offs between lowest thermal resistance and maximum heat carrying load exists, and the actual wick geometry will be dictated by application specific requirements. Finally, we highlight the importance of accurately obtaining the accommodation coefficients to predict the effective wick thermal conductivity. The present work would enable in optimal design of micropillar wicks (with low thermal resistance and high dry-out heat flux) and the same methodology can be extended to other types of wick structures as well. NRF (Natl Research Foundation, S’pore) 2020-06-30T06:17:25Z 2020-06-30T06:17:25Z 2018 Journal Article Somasundaram, S., Zhu, Y., Lu, Z., Adera, S., Bin, H., Mengyao, W., . . . Wang, E. N. (2018). Thermal design optimization of evaporator micropillar wicks. International Journal of Thermal Sciences, 134, 179-187. doi:10.1016/j.ijthermalsci.2018.07.036 1290-0729 https://hdl.handle.net/10356/142783 10.1016/j.ijthermalsci.2018.07.036 2-s2.0-85051394570 134 179 187 en International Journal of Thermal Sciences © 2018 Elsevier Masson SAS. All rights reserved.
spellingShingle Engineering::Electrical and electronic engineering
Vapor Chambers
Evaporator
Somasundaram, Sivanand
Zhu, Yangying
Lu, Zhengmao
Adera, Solomon
Bin, He
Mengyao, Wei
Tan, Chuan Seng
Wang, Evelyn N.
Thermal design optimization of evaporator micropillar wicks
title Thermal design optimization of evaporator micropillar wicks
title_full Thermal design optimization of evaporator micropillar wicks
title_fullStr Thermal design optimization of evaporator micropillar wicks
title_full_unstemmed Thermal design optimization of evaporator micropillar wicks
title_short Thermal design optimization of evaporator micropillar wicks
title_sort thermal design optimization of evaporator micropillar wicks
topic Engineering::Electrical and electronic engineering
Vapor Chambers
Evaporator
url https://hdl.handle.net/10356/142783
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