Cu-Cu bonding in ambient environment by Ar/N 2 plasma surface activation and its characterization
Ar/N 2 plasma surface activation in ambient environment for Cu-Cu bonding has been performed and characterized. Cu-Cu bonding occurs at room temperature and under normal atmospheric conditions. Postbonding annealing is performed at 300 °C and below to control the overall thermal budget. Shear streng...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Journal Article |
| Language: | English |
| Published: |
2020
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/143486 |