Decapsulation of 3D multi-die stacked package
Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation techn...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
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2020
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/143489 |
| _version_ | 1826122801863458816 |
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| author | Kor, Katherine Hwee Boon Liu, Q. Siah, Yu Wen Gan, Chee Lip |
| author2 | School of Materials Science and Engineering |
| author_facet | School of Materials Science and Engineering Kor, Katherine Hwee Boon Liu, Q. Siah, Yu Wen Gan, Chee Lip |
| author_sort | Kor, Katherine Hwee Boon |
| collection | NTU |
| description | Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis. |
| first_indexed | 2024-10-01T05:54:27Z |
| format | Conference Paper |
| id | ntu-10356/143489 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T05:54:27Z |
| publishDate | 2020 |
| record_format | dspace |
| spelling | ntu-10356/1434892020-09-26T22:15:42Z Decapsulation of 3D multi-die stacked package Kor, Katherine Hwee Boon Liu, Q. Siah, Yu Wen Gan, Chee Lip School of Materials Science and Engineering 2015 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits Temasek Laboratories Engineering::Materials Decapsulation 3D Devices Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation technique to access each individual die from a four-die stacked package, while maintaining the structural integrity of each die for further failure analysis. Accepted version 2020-09-04T06:32:55Z 2020-09-04T06:32:55Z 2015 Conference Paper Kor, K. H. B., Liu, Q., Siah, Y. W., & Gan, C. L. (2015). Decapsulation of 3D multi-die stacked package. 2015 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 465-468. doi:10.1109/IPFA.2015.7224433 9781479999286 https://hdl.handle.net/10356/143489 10.1109/IPFA.2015.7224433 2-s2.0-84949744570 465 468 en © 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, in any current or future media, including reprinting/republishing this material for adverstising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at:https://doi.org/10.1109/IPFA.2015.7224433 application/pdf |
| spellingShingle | Engineering::Materials Decapsulation 3D Devices Kor, Katherine Hwee Boon Liu, Q. Siah, Yu Wen Gan, Chee Lip Decapsulation of 3D multi-die stacked package |
| title | Decapsulation of 3D multi-die stacked package |
| title_full | Decapsulation of 3D multi-die stacked package |
| title_fullStr | Decapsulation of 3D multi-die stacked package |
| title_full_unstemmed | Decapsulation of 3D multi-die stacked package |
| title_short | Decapsulation of 3D multi-die stacked package |
| title_sort | decapsulation of 3d multi die stacked package |
| topic | Engineering::Materials Decapsulation 3D Devices |
| url | https://hdl.handle.net/10356/143489 |
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