Decapsulation of 3D multi-die stacked package

Decapsulation of 3D multi-die stacked package

Although a combination of laser, mechanical and chemical techniques can be used to expose a very large and thin die from a multi-die stacked package, package warping and die crack occur in the process of gaining access to each die. The aim of this paper is to investigate the sample preparation techn...

书目详细资料
Main Authors:	Kor, Katherine Hwee Boon, Liu, Q., Siah, Yu Wen, Gan, Chee Lip
其他作者:	School of Materials Science and Engineering
格式:	Conference Paper
语言:	English
出版:	2020
主题:	Engineering::Materials Decapsulation 3D Devices
在线阅读:	https://hdl.handle.net/10356/143489

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