Fabrication of vertical side-wall submicron emitter for heterojunction bipolar transistors

In this investigation, several dry etching processes have been systematically studied for submicron emitter formation for metamorphic heterojunction bipolar transistor (MHBT) devices. CH4/H2/O2 chemistry is shown to offer better side wall etch profile and smoother surface compared to other gas mixtu...

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Main Authors: Radhakrishnan, K., Wang, Hong
Other Authors: School of Electrical and Electronic Engineering
Format: Research Report
Language:English
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/14525
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author Radhakrishnan, K.
Wang, Hong
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Radhakrishnan, K.
Wang, Hong
author_sort Radhakrishnan, K.
collection NTU
description In this investigation, several dry etching processes have been systematically studied for submicron emitter formation for metamorphic heterojunction bipolar transistor (MHBT) devices. CH4/H2/O2 chemistry is shown to offer better side wall etch profile and smoother surface compared to other gas mixtures. Optimized HBT emitter etching process is developed by combining the plasma dry etching and the wet etching techniques. Submicron sized (0.6 μm × 20 μm) emitters have been demonstrated using direct electron beam lithography. RF performance of the MHBT devices (1.0×20 μm2) fabricated using the new dry-wet etch combination demonstrates fT and fMAX values of 92 GHz and 122 GHz, respectively. These values are higher than HBTs fabricated using all-wet-etch process.
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spelling ntu-10356/145252023-03-04T03:20:12Z Fabrication of vertical side-wall submicron emitter for heterojunction bipolar transistors Radhakrishnan, K. Wang, Hong School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits In this investigation, several dry etching processes have been systematically studied for submicron emitter formation for metamorphic heterojunction bipolar transistor (MHBT) devices. CH4/H2/O2 chemistry is shown to offer better side wall etch profile and smoother surface compared to other gas mixtures. Optimized HBT emitter etching process is developed by combining the plasma dry etching and the wet etching techniques. Submicron sized (0.6 μm × 20 μm) emitters have been demonstrated using direct electron beam lithography. RF performance of the MHBT devices (1.0×20 μm2) fabricated using the new dry-wet etch combination demonstrates fT and fMAX values of 92 GHz and 122 GHz, respectively. These values are higher than HBTs fabricated using all-wet-etch process. 2008-11-27T01:43:44Z 2008-11-27T01:43:44Z 2007 2007 Research Report http://hdl.handle.net/10356/14525 en 51 p. application/pdf
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
Radhakrishnan, K.
Wang, Hong
Fabrication of vertical side-wall submicron emitter for heterojunction bipolar transistors
title Fabrication of vertical side-wall submicron emitter for heterojunction bipolar transistors
title_full Fabrication of vertical side-wall submicron emitter for heterojunction bipolar transistors
title_fullStr Fabrication of vertical side-wall submicron emitter for heterojunction bipolar transistors
title_full_unstemmed Fabrication of vertical side-wall submicron emitter for heterojunction bipolar transistors
title_short Fabrication of vertical side-wall submicron emitter for heterojunction bipolar transistors
title_sort fabrication of vertical side wall submicron emitter for heterojunction bipolar transistors
topic DRNTU::Engineering::Electrical and electronic engineering::Electronic circuits
url http://hdl.handle.net/10356/14525
work_keys_str_mv AT radhakrishnank fabricationofverticalsidewallsubmicronemitterforheterojunctionbipolartransistors
AT wanghong fabricationofverticalsidewallsubmicronemitterforheterojunctionbipolartransistors