Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability
Communication contention and thermal susceptibility are two potential issues in optical network-on-chip (ONoC) architecture, which are both critical for ONoC designs. However, minimizing conflict and guaranteeing thermal reliability are incompatible in most cases. In this paper, we present a routing...
| Main Authors: | , , , , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Language: | English |
| Published: |
2020
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/145285 |
| _version_ | 1826126175591727104 |
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| author | Li, Mengquan Liu, Weichen Yang, Lei Chen, Peng Liu, Duo Guan, Nan |
| author2 | School of Computer Science and Engineering |
| author_facet | School of Computer Science and Engineering Li, Mengquan Liu, Weichen Yang, Lei Chen, Peng Liu, Duo Guan, Nan |
| author_sort | Li, Mengquan |
| collection | NTU |
| description | Communication contention and thermal susceptibility are two potential issues in optical network-on-chip (ONoC) architecture, which are both critical for ONoC designs. However, minimizing conflict and guaranteeing thermal reliability are incompatible in most cases. In this paper, we present a routing criterion in the network level. Combined with device-level thermal tuning, it can implement thermal-reliable ONoC. We further propose two routing approaches (including a mixed-integer linear programming (MILP) model and a heuristic algorithm (CAR)) to minimize communication conflict based on the guaranteed thermal reliability, and meanwhile, mitigate the energy overheads of thermal regulation in the presence of chip thermal variations. By applying the criterion, our approaches achieve excellent performance with largely reduced complexity of design space exploration. Evaluation results on synthetic communication traces and realistic benchmarks show that the MILP-based approach achieves an average of 112.73% improvement in communication performance and 4.18% reduction in energy overhead compared to state-of-the-art techniques. Our heuristic algorithm only introduces 4.40% performance difference compared to the optimal results and is more scalable to large-size ONoCs. |
| first_indexed | 2024-10-01T06:48:24Z |
| format | Conference Paper |
| id | ntu-10356/145285 |
| institution | Nanyang Technological University |
| language | English |
| last_indexed | 2024-10-01T06:48:24Z |
| publishDate | 2020 |
| record_format | dspace |
| spelling | ntu-10356/1452852020-12-16T08:24:06Z Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability Li, Mengquan Liu, Weichen Yang, Lei Chen, Peng Liu, Duo Guan, Nan School of Computer Science and Engineering Asia and South Pacific Design Automation Conference Engineering::Computer science and engineering Optical Network-On-Chip Thermal Susceptibility Communication contention and thermal susceptibility are two potential issues in optical network-on-chip (ONoC) architecture, which are both critical for ONoC designs. However, minimizing conflict and guaranteeing thermal reliability are incompatible in most cases. In this paper, we present a routing criterion in the network level. Combined with device-level thermal tuning, it can implement thermal-reliable ONoC. We further propose two routing approaches (including a mixed-integer linear programming (MILP) model and a heuristic algorithm (CAR)) to minimize communication conflict based on the guaranteed thermal reliability, and meanwhile, mitigate the energy overheads of thermal regulation in the presence of chip thermal variations. By applying the criterion, our approaches achieve excellent performance with largely reduced complexity of design space exploration. Evaluation results on synthetic communication traces and realistic benchmarks show that the MILP-based approach achieves an average of 112.73% improvement in communication performance and 4.18% reduction in energy overhead compared to state-of-the-art techniques. Our heuristic algorithm only introduces 4.40% performance difference compared to the optimal results and is more scalable to large-size ONoCs. Accepted version This work is supported by NTU NAP M4082282 and SUG M4082087, HP-NTU Digital Manufacturing Corporate Lab, Singapore and NSFC 61772094, China. 2020-12-16T08:24:06Z 2020-12-16T08:24:06Z 2019 Conference Paper Li, M., Liu, W., Yang, L., Chen, P., Liu, D., & Guan, N. (2019). Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability. Proceedings of the 24th Asia and South Pacific Design Automation Conference, 364-369. doi:10.1145/3287624.3287650 https://hdl.handle.net/10356/145285 10.1145/3287624.3287650 364 369 en © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1145/3287624.3287650 application/pdf |
| spellingShingle | Engineering::Computer science and engineering Optical Network-On-Chip Thermal Susceptibility Li, Mengquan Liu, Weichen Yang, Lei Chen, Peng Liu, Duo Guan, Nan Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability |
| title | Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability |
| title_full | Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability |
| title_fullStr | Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability |
| title_full_unstemmed | Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability |
| title_short | Routing in optical network-on-chip : minimizing contention with guaranteed thermal reliability |
| title_sort | routing in optical network on chip minimizing contention with guaranteed thermal reliability |
| topic | Engineering::Computer science and engineering Optical Network-On-Chip Thermal Susceptibility |
| url | https://hdl.handle.net/10356/145285 |
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