| Summary: | Moving Mechanical Assemblies could be considered a type of microelectromechanical
systems (MEMS) and are usually small integrated devices or systems that combine
electrical and mechanical components. They range in size from the millimeter level to
the submicron level, usually with a moving or suspended part, and integrated together
with at least some electronic circuitry. MEMS are presently being considered for both
microsensor and micro-actuator applications. Sensors detect physical and chemical
signals. Actuators can drive micro-components, including optical mirrors, displays, fluid
controllers and turbines. The current generation of MEMS are fabricated using
processing technology such as lithography and etching derived from silicon (Si)
microelectronics.
One tends to compare MEMS with silicon microelectronics but there is a fundamental
difference. MEMS require a greater diversity of models, simulations and packaging
approaches than ICs. MEMS further extend the fabrication techniques developed for the
integrated circuit industry to add mechanical elements such as beams, bridges, gears,
diaphragms and springs to devices. Another distinction is that typically 3-D structures
required for many MEMS applications (optical, mechanical, etc) create a need for nonstandard
materials and non-polygonal geometries. MEMS are not about any one
application or device, nor are they defined by a single fabrication process or limited to a
few materials. They are a fabrication approach that conveys the advantages of
miniaturization, multiple materials components and microelectronics to the design and
construction of integrated electromechanical systems. In addition, MEMS are not only
about miniaturization of mechanical systems; they also provide a new paradigm for
designing mechanical devices and systems.
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