Thermal reliability of a bilayer of Ni(P)/Cu as a diffusion barrier for Cu/Sn/Cu bonding

Thermal reliability of a bilayer of Ni(P)/Cu as a diffusion barrier for Cu/Sn/Cu bonding

This study examines the effects of barrier layers on the aging behavior of Cu/Sn bonding for three-dimensional (3D) integration. We compare the behavior of different bonding structures [Cu/Sn with no barrier, Ni(P) barrier, and Ni(P)/Cu bilayer barrier] after aging samples at 150 °C for long duratio...

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Bibliographic Details
Main Authors:	Lee, Byunghoon, Jeon, Haseok, Gan, Chee Lip, Lee, Hoo-Jeong
Other Authors:	School of Materials Science and Engineering
Format:	Journal Article
Language:	English
Published:	2021
Subjects:	Engineering::Materials Interfacial Reaction Shear-strength
Online Access:	https://hdl.handle.net/10356/146754

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